MLCC Internal Electrode Thickness Layout for Outer-Region Connectivity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer ceramic capacitors face issues with deteriorated connectivity and reduced thickness of internal electrodes in the outermost regions due to deformation stress during the lamination process, leading to poor connectivity with external electrodes and compromised warpage strength.
Innovation Solution
The multilayer electronic component design includes thicker internal electrodes in the outer regions adjacent to the cover portions, with increased thicknesses compared to the central regions, to enhance connectivity and warpage strength without using dummy electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If internal electrodes are disposed in the outermost region during lamination, then capacitance formation is achieved, but deformation stress increases causing deteriorated connectivity and reduced thickness
Solution Approach 1:
The patent applies local quality by differentiating the thickness of internal electrodes based on their position within the multilayer body. Specifically, the internal electrodes in the outermost region (adjacent to cover portions) are designed with greater thickness compared to those in inner regions. This localized variation in electrode thickness addresses the deformation stress issue at critical outer regions while maintaining overall capacitance performance.
2Ease of manufacture
If internal electrodes in outermost region are pressed during lamination, then multilayer structure is formed, but warpage strength properties deteriorate
Solution Approach 1:
The patent implements local quality by varying the thickness of internal electrodes according to their position. The outermost internal electrodes are made thicker to specifically address warpage strength requirements in regions subjected to highest deformation stress during lamination, while inner electrodes maintain standard thickness.
Solution Approach 2:
The patent applies preliminary action by pre-designing the internal electrode thickness distribution before the lamination process. The outermost internal electrodes are intentionally formed with greater thickness in advance, so that when deformation stress occurs during pressing, these thicker electrodes can better maintain connectivity and prevent warpage without requiring additional compensatory measures.
3Ease of manufacture
If uniform thickness internal electrodes are used throughout, then manufacturing simplicity is maintained, but outer region electrodes suffer from reduced thickness and poor connectivity
Solution Approach 1:
The patent resolves this contradiction by implementing local quality through position-dependent electrode thickness design. The manufacturing process is extended to create non-uniform electrode thickness, where outermost electrodes are thicker and inner electrodes are thinner. This approach prioritizes the critical outer region connectivity over uniform manufacturing simplicity.
Data Source
AI summary
A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and first and second internal electrodes disposed alternately in a first direction with the dielectric layer interposed therebetween, and cover portions disposed in an upper portion and a lower portion of the capacitance formation portion in the first direction; and external electrodes disposed on the body, wherein the capacitance formation portion includes outer regions adjacent to the cover portion and a central region other than the outer region, and wherein an average thickness of the first internal electrode included in the outer region is greater than an average thickness of the first internal electrode included in the central region, and an average thickness of the second internal electrode included in the outer region is greater than an average thickness of the second internal electrode included in the central region.