MLCC External Electrode Thickness Layout for ESR Reliability
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Solution Overview
Problem
Multilayer ceramic capacitors (MLCCs) face reliability issues due to excessively thin corner portions of external electrodes formed by the dipping method, leading to plating solution penetration and increased equivalent series resistance (ESR) failure, which compromises their connectivity, mountability, and overall reliability.
Innovation Solution
The ceramic electronic component incorporates external electrodes with electrode layers and conductive resin layers, where the thickness ratio (ta2/ta1) of the electrode layers at the central portion to those at the boundary between the capacitance formation and protective portions is 0.05 or greater, ensuring enhanced moisture resistance and reduced ESR failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the dipping method is used to form external electrodes, then the manufacturing process is simple and efficient, but the corner portions of the external electrodes become excessively thin
Solution Approach 1:
The patent applies local quality by forming a first external electrode layer with non-uniform thickness, where the thickness at corner portions is specifically controlled to be greater than at central portions. This local variation in thickness distribution resolves the contradiction by maintaining manufacturing simplicity while achieving uniform electrode thickness, preventing plating solution penetration at thin corner regions.
2Reliability
If the electrode layer thickness at corner portions is increased, then plating solution penetration is prevented, but the manufacturing complexity increases
Solution Approach 1:
The patent applies parameter changes by controlling the thickness parameter of the first external electrode layer to create a specific thickness distribution pattern. The thickness at corner portions is set to be greater than at central portions, with specific thickness ratios defined. This parameter optimization achieves improved reliability through prevented plating solution penetration while avoiding excessive manufacturing complexity by using a controlled, systematic approach rather than complex multi-layer structures.
3Ease of operation
If a plating layer is formed on thin external electrodes, then connectivity and mountability are improved, but plating solution penetrates into the capacitor body
Solution Approach 1:
The patent applies preliminary action by pre-forming a first external electrode layer with optimized thickness distribution before applying the plating layer. The corner portions are specifically thickened in advance to create a barrier that prevents plating solution penetration during subsequent plating processes. This preliminary structural preparation ensures both improved mountability through better connectivity and protected capacitor body integrity.
4Volume of moving object
If the external electrode thickness is reduced for miniaturization, then the capacitor size is reduced, but the equivalent series resistance (ESR) failure risk increases
Solution Approach 1:
The patent applies local quality by creating a non-uniform thickness distribution in the first external electrode layer, with specifically thicker corner portions and optimized central portions. This local variation allows the overall capacitor to be miniaturized while maintaining sufficient current path thickness at critical locations, thereby reducing ESR failure risk despite reduced overall size.
Data Source
AI summary
A ceramic electronic component includes a body including a capacitance formation portion including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween and forming capacitance and protective portions disposed on upper and lower surfaces of the capacitance formation portion and external electrodes including electrode layers disposed on the body and connected to the plurality of internal electrodes and conductive resin layers respectively disposed on the electrode layers, wherein ta2/ta1 is 0.05 or greater, where ta1 is the thickness of the electrode layer at a central portion of the capacitance formation portion and ta2 is the thickness of the electrode layer at a boundary between the capacitance formation portion and the protective portion.