MLCC Internal Electrode Thickness Variation for Crack Reduction
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Solution Overview
Problem
Multilayer ceramic capacitors (MLCCs) face issues with crack generation due to accumulated stepped height differences in marginal portions, which can lead to electrical characteristic deterioration and reliability issues, particularly as component size decreases and capacitance increases.
Innovation Solution
The internal electrode layers in the marginal portions of MLCCs are made thicker than those in the overlapped portions, with the thickness ranging from 105% to 200% of the overlapped portion's thickness, and narrower in width, to reduce the stepped height difference and alleviate stress-induced cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the stacked number is increased to achieve small size and high capacitance, then the capacitance per unit volume increases, but the accumulated stepped height difference in the marginal portion increases, leading to crack generation
Solution Approach 1:
The patent applies local quality by making the internal electrode pattern thickness non-uniform: thicker in marginal portions and thinner in overlapped portions. This local variation in thickness compensates for the stepped height difference accumulated in marginal portions when multiple layers are stacked, thereby preventing crack generation while enabling high capacitance in small size.
2Manufacturing precision
If compression is enhanced to alleviate the accumulated stepped height difference, then the marginal portion is depressed, but cutting defects increase due to bar deformation and electrical characteristics deteriorate due to electrode and dielectric deformation
Solution Approach 1:
The patent applies preliminary action by pre-forming the internal electrode pattern with varying thickness before stacking and compression. The thicker regions in marginal portions are created in advance during the printing stage, so that when stacking occurs, the stepped height difference is already compensated. This eliminates the need for excessive compression that would cause bar deformation and cutting defects.
3Manufacturing precision
If compression is enhanced to alleviate the accumulated stepped height difference, then the marginal portion is depressed, but electrode and dielectric deformation occurs, deteriorating electrical characteristics such as IR and BDV
Solution Approach 1:
The patent applies preliminary action by pre-forming the internal electrode pattern with varying thickness before stacking and compression. The thicker regions in marginal portions are created in advance during the printing stage, so that when stacking occurs, the stepped height difference is already compensated. This eliminates the need for excessive compression that would cause bar deformation and cutting defects.
Solution Approach 2:
The patent applies local quality by making the internal electrode pattern thickness non-uniform: thicker in marginal portions and thinner in overlapped portions. This local variation in thickness compensates for the stepped height difference accumulated in marginal portions when multiple layers are stacked, thereby preventing crack generation while enabling high capacitance in small size.
Data Source
AI summary
Disclosed herein are a multilayer ceramic electronic component and a method for manufacturing the same. The multilayer ceramic electronic component includes a multilayer body in which dielectric layers and internal electrode layers are alternately stacked and external electrodes, wherein a portion in the internal electrode layers positioned in a marginal portion in which vertically neighboring internal electrode layers in the multilayer body is not overlapped with each other has a thickness thicker than that of a portion of the internal electrode layer positioned in an overlapped portion in which the vertically neighboring internal electrode layers are overlapped with each other, such that an accumulated stepped height difference in the marginal portion is reduced.


