External Electrode Curvature Control for MLCC Laser Via Formation
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Solution Overview
Problem
Miniaturization of electronic components, such as multilayer ceramic capacitors (MLCCs), leads to challenges in forming external electrodes with uniform shapes, resulting in unreliable connections and increased glare reflection during laser machining, which causes defects in via formation due to high curvature.
Innovation Solution
The development of an electronic component with external electrodes having a maximum curvature of 7° or less, formed using a dipping method with electrode paste viscosity between 800 to 18,000 cps, and a blotting process to adjust the curvature and bandwidth, ensuring efficient connectivity and reduced glare reflection during laser machining.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the MLCC is minimized, then the volume of the electronic component is reduced, but it becomes difficult to form the external electrode with a uniform shape
Solution Approach 1:
The patent applies parameter changes by controlling the viscosity of electrode paste within 800 to 18,000 cps and adjusting the dipping speed to 0.01 to 2 mm/s. These parameter optimizations enable uniform external electrode formation on miniaturized MLCCs (1.0 mm width × 0.5 mm height or less) despite the reduced size, resolving the contradiction between miniaturization and manufacturing precision.
2Area of moving object
If the external electrode has high curvature, then the bandwidth is increased, but glare reflection during laser machining occurs causing via formation defects
Solution Approach 1:
The patent controls the curvature of the external electrode by optimizing electrode paste viscosity (800 to 18,000 cps) and dipping parameters. This ensures the maximum curvature is 7° or less in the via machining region, preventing glare reflection during laser via formation while maintaining sufficient bandwidth for reliable electrical connection.
Solution Approach 2:
The patent replaces traditional high-curvature electrode formation methods with a controlled dipping process using viscosity-modified electrode paste. This substitution eliminates the glare reflection problem during laser machining while preserving the necessary electrode bandwidth, resolving the contradiction between area and harmful optical effects.
3Object-affected harmful factors
If the external electrode curvature is reduced to 7° or less, then glare reflection is minimized, but the bandwidth may be reduced
Solution Approach 1:
The patent optimizes electrode paste viscosity to 800 to 18,000 cps and controls dipping speed at 0.01 to 2 mm/s. These parameter changes enable the external electrode to achieve both low curvature (7° or less) for minimal glare reflection and sufficient bandwidth for reliable connection, simultaneously addressing both requirements without compromise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the glare reflection phenomenon and incidence of defective via formation, enhancing the reliability of electronic component connections and manufacturing efficiency.
Implementation Method 1
dipping a body part in a surface plate in which electrode paste having viscosity of 800 to 18,000 cps is immersed; and blotting the dipped body part
Data Source
AI summary
Disclosed herein are an electronic component and a method of manufacturing the same. In an electronic component having a conductor formed in an insulator and providing an external electrode electrically connected to the conductor on an outer surface of the insulator, a curvature of the external electrode in a via machining region is decreased at a predetermined level or less, thereby making it possible to decrease defect generation due to a glare-reflection of a laser.