MLCC External Electrode Structure for Void-Free Solder Joints
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Solution Overview
Problem
The generation of voids in solder during the mounting of multi-layer ceramic capacitors leads to stagnated heat dissipation and potential cracking, as air can become trapped, affecting the reliability of the connection and thermal properties.
Innovation Solution
The design incorporates L-shaped main surface protrusions on the end external electrodes, which guide the solder flow and prevent air from mixing into the solder, ensuring a void-free connection by defining the solder flow path and promoting smooth wetting and spreading without air incorporation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is applied during mounting, then electrical connection is achieved, but air can be mixed into the solder causing voids
Solution Approach 1:
The protrusion is formed on the external electrode before soldering, creating a predetermined solder flow path that guides molten solder away from air pockets. This preliminary structural modification prevents air mixing during the soldering process, eliminating void formation while maintaining connection reliability
Solution Approach 2:
The protrusion acts as an intermediary structure between the external electrode and the solder. It modifies the solder flow behavior by creating a specific flow path, thereby mediating the interaction between solder and air to prevent air entrapment and void formation
2Reliability
If air is trapped in solder, then voids are generated, but heat dissipation stagnates and cracks may form
Solution Approach 1:
The protrusion structure is pre-formed to create a void-free solder joint. By establishing a predetermined solder flow path before soldering, it prevents air entrapment that would otherwise cause voids, ensuring proper thermal conduction and preventing heat dissipation stagnation
Solution Approach 2:
The protrusion, which adds structural complexity, converts the potential harm of air mixing into a benefit by actively guiding solder flow. This transformation ensures complete solder coverage and eliminates voids, improving both mechanical strength and thermal performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the formation of voids in the solder, enhancing the connection reliability and heat dissipation properties of the multi-layer ceramic capacitors by ensuring a strong, air-free interface with the mounting board.
Implementation Method 1
the solder sequentially wets and spreads around the corner with the corner as a starting point during mounting
Implementation Method 2
a rotation is caused by the surface tension that acts on the external electrode from the molten solder, to promote the discharge of the air from the molten solder
Data Source
AI summary
A multi-layer ceramic electronic component includes: a ceramic body including a main surface, an end surface, and a side surface respectively perpendicular to a first axis, a second axis, and a third axis orthogonal to one another, a top portion that connects the main surface, the end surface, and the side surface to one another, and a plurality of internal electrodes laminated in a direction of the first axis; and an end external electrode including a corner portion located on the top portion, a base portion that covers the end surface and extends from the end surface to the main surface and the side surface, and a protrusion that protrudes from the base portion in a thickness direction, the protrusion including an L-shaped main surface protrusion located on the main surface and extending in directions of the second axis and the third axis from the corner portion.