Multilayer Ceramic Capacitor Electrodes for Lower ESR Plating
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Solution Overview
Problem
Conventional multilayer ceramic capacitors face high equivalent series resistance (ESR) due to low contact probability of conductive fillers and plating defects at the interface between the conductive resin layer and the plated layer, leading to decreased conductivity.
Innovation Solution
A multilayer ceramic capacitor design featuring a conductive resin layer with dispersed metal particles, where the abundance ratio of metal particles is higher on the side closer to the plated layer, enhancing electrical contact and reducing plating defects by forming an uneven distribution that improves conductivity between the conductive resin layer and the plated layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive fillers are dispersed in the conductive resin layer, then the conductivity of the conductive resin layer is ensured, but when the contact probability of conductive fillers is low, equivalent series resistance (ESR) becomes high
Solution Approach 1:
The patent uses a composite material system consisting of conductive fillers (silver powder), metal particles (copper or nickel), and thermosetting resin. This multi-component composite structure combines the high conductivity of silver fillers with the plating-promoting properties of metal particles, achieving both low ESR and good plating coverage through material composition rather than relying solely on filler contact probability
Solution Approach 2:
The patent creates local quality differences by having metal particles predominantly distributed near the interface with the plated layer, while conductive fillers are distributed throughout the conductive resin layer. This spatial differentiation of material functions ensures that conductivity is maintained throughout the layer while plating quality is enhanced at the critical interface region
2Reliability
If conductive fillers are used in the conductive resin layer, then conductivity is provided, but when conductive fillers near the interface are covered with thermosetting resin, plating hardly deposits on the covered portion
Solution Approach 1:
The patent introduces metal particles (copper or nickel) as intermediary substances between the conductive fillers and the plated layer. These metal particles serve as a mediator that promotes plating deposition while maintaining electrical conductivity, effectively bridging the gap between the insulating thermosetting resin and the plating process
Solution Approach 2:
The patent creates local quality differences by having metal particles predominantly distributed near the interface with the plated layer, while conductive fillers are distributed throughout the conductive resin layer. This spatial differentiation of material functions ensures that conductivity is maintained throughout the layer while plating quality is enhanced at the critical interface region
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively decreases ESR and prevents plating defects, enhancing the electrical conductivity and reliability of the multilayer ceramic capacitors.
Implementation Method 1
the conductivity in the conductive resin layer, and the conductivity between the conductive resin layer and the plated layer rely on the contact probability of the conductive fillers
Data Source
AI summary
A multilayer ceramic capacitor includes a multilayer body including dielectric layers which are stacked and internal electrode layers which are stacked, and external electrodes, each connected to the internal electrode layers. The external electrodes each include a conductive resin layer and a plated layer on the conductive resin layer. The conductive resin layer includes a resin portion, conductive fillers dispersed in the resin portion, and metal particles dispersed unevenly in a distribution differing from that of the conductive fillers in the conductive resin layer. An abundance ratio of the metal particles to the resin portion is higher on a side of the plated layer of the conductive resin layer than on a side of the conductive resin layer close to the multilayer body.