Multilayer Ceramic Capacitor Electrodes With Matched Sintering

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Solution Overview

Problem

Existing multilayer ceramic capacitors face challenges in achieving high capacitance due to reduced coverage of thin-layer inner electrodes, which is exacerbated by the disparity in sintering temperatures between conductive metal particles and ceramic dielectric layers.

Innovation Solution

Incorporating CuTiO3, CoTiO3, or CrTiO3 as ceramic materials in the inner electrodes, which have an ilmenite crystal structure, to align the sintering temperatures of the inner electrodes with those of the dielectric layers, thereby maintaining high coverage even when formed as thin layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the thickness of inner electrodes is reduced to form thin layers, then the size of the multilayer ceramic capacitor is reduced, but the coverage of the inner electrodes decreases

Engineering Contradiction:
Improvesize of capacitorVSAvoidcoverage of inner electrodes
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent changes the chemical composition parameters of the conductive paste by incorporating specific ceramic materials (BaTiO3, SrTiO3, CaZrO3) with controlled particle sizes and ratios. This modifies the sintering behavior and physical properties of the inner electrodes, enabling thin-layer formation while maintaining high coverage through optimized material parameters rather than geometric changes alone.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite conductive paste material combining conductive metal particles with specific ceramic materials (BaTiO3, SrTiO3, CaZrO3) in defined ratios. This composite structure allows the inner electrodes to maintain both thin profile and high coverage by leveraging the complementary properties of the constituent materials during sintering and firing processes.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If the sintering temperature of conductive metal particles is increased to improve coverage, then the coverage of inner electrodes increases, but the temperature disparity with dielectric layers increases

Engineering Contradiction:
Improvecoverage of inner electrodesVSAvoidsintering temperature difference
Core Design Contradiction:
Manufacturing precisionVSTemperature

Solution Approach 1:

The patent introduces ceramic particles (BaTiO3, SrTiO3, CaZrO3) as intermediary materials in the conductive paste that mediate between the conductive metal particles and the dielectric layers. These intermediary ceramic particles have sintering characteristics that bridge the temperature gap, allowing the inner electrodes to achieve high coverage while the overall sintering temperature remains coordinated with the dielectric layer formation temperature.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent modifies the thermal parameters of the conductive paste by incorporating ceramic materials with specific sintering temperatures. This changes the temperature profile during firing, enabling the inner electrodes to sinter at temperatures that are closer to those of the dielectric layers, thereby reducing temperature disparity while maintaining high coverage.

Inventive Principle:
Principle #35Parameter changes

3Quantity of substance

If thin-layer inner electrodes are formed, then the capacitance density increases, but the low coverage hinders increasing the total capacitance

Engineering Contradiction:
Improvecapacitance densityVSAvoidcoverage of inner electrodes
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent optimizes multiple parameters simultaneously: the thickness of the inner electrode layer, the particle size distribution of conductive and ceramic materials, the ratio of ceramic to metal particles, and the firing temperature profile. These parameter changes work together to achieve high capacitance density through thin layers while preventing coverage loss through material composition optimization.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite conductive paste containing conductive metal particles combined with specific ratios of BaTiO3, SrTiO3, and/or CaZrO3 ceramic particles. This composite material enables the inner electrodes to achieve both high coverage and thin-layer formation, thereby realizing high total capacitance by combining the benefits of high capacitance density with high coverage.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of CuTiO3, CoTiO3, or CrTiO3 in the inner electrodes ensures high coverage and supports increased capacitance without compromising the integrity of the multilayer ceramic capacitors.

Implementation Method 1

it is possible to shift the onset of sintering of the metal particles included in the conductive paste films that are to be the inner electrodes toward higher temperatures and thereby to bring the temperature at which the metal particles included in the conductive paste films sinter closer to the temperature at which the ceramic that forms the dielectric layers sinters

Methodology Applied
Scientific EffectSintering: Sintering

Data Source

PatentUS12412700B2Multilayer ceramic capacitor
Publication Date: 2025.09.09 MURATA MFG CO LTD
  • US12412700B2 patent drawing

AI summary

A multilayer ceramic capacitor includes a multilayer body including dielectric layers made of ceramic and stacked together, and inner electrodes arranged along interfaces between the dielectric layers with each inner electrode extending along a respective interface. The inner electrodes include at least one of CuTiO3, CoTiO3, or CrTiO3, and a conductive metal that is preferably copper.