Multilayer Ceramic Capacitor Electrodes With Tensile-Stressed Ni Plating
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Solution Overview
Problem
Existing multilayer ceramic electronic components face challenges in reducing Equivalent Series Resistance (ESR) while maintaining durability under severe environments, such as thermal expansion and bending stress.
Innovation Solution
The multilayer ceramic components incorporate a structure with internal conductive layers exposed at end surfaces, external electrodes comprising a base electrode layer, an electrically conductive resin layer with thermosetting resin, and a Ni plated layer with tensile stress, which compresses the resin layer to enhance conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional external electrode structure with thermosetting resin is used, then durability under thermal expansion and bending stress is improved, but Equivalent Series Resistance (ESR) remains high
Solution Approach 1:
The patent applies parameter changes by introducing tensile stress into the Ni plated layer through controlled plating conditions. This stress parameter modification causes the Ni layer to contract upon cooling, compressing the electrically conductive resin layer and improving filler contact, thereby reducing ESR while maintaining the thermosetting resin structure for durability
Solution Approach 2:
The patent uses composite materials by combining the thermosetting resin matrix with electrically conductive fillers (such as metal powder) to create the electrically conductive resin layer. This composite structure provides both the mechanical durability of thermosetting resin and the electrical conductivity needed to reduce ESR
2Object-generated harmful factors
If the Ni plated layer is made thicker to improve conductivity, then ESR is reduced, but internal stress and potential delamination increase
Solution Approach 1:
The patent modifies the stress parameter of the Ni plated layer by controlling plating conditions to generate tensile stress. This allows the Ni layer to act as a pre-stressed element that compresses the resin layer when cooled, improving conductivity without requiring excessive thickness that would cause delamination
Solution Approach 2:
The patent replaces the traditional approach of increasing layer thickness to improve conductivity with a mechanical stress field approach. By introducing tensile stress in the Ni plated layer, the system achieves improved electrical contact through stress-induced compression rather than through increased material thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces ESR and improves initial characteristics by increasing the contact between electrically conductive fillers, enhancing conductivity and adhesion, while maintaining durability under severe conditions.
Implementation Method 1
tensile stress remains as internal stress inside the first Ni plated layer; and tensile stress remains as internal stress inside the second Ni plated layer
Data Source
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AI summary
Provided are multilayer ceramic electronic components that are each able to reduce ESR. A multilayer ceramic capacitor 1 includes a first external electrode 40A and a second external electrode 40B. The first external electrode 40A includes a first base electrode layer 50A, a first electrically conductive resin layer 60A that is provided on the first base electrode layer 50A and includes a thermosetting resin and a metal component, and a first Ni plated layer 71A provided on the first electrically conductive resin layer 60A. The second external electrode 40B includes a second base electrode layer 50B, a second electrically conductive resin layer 60B that is provided on the second base electrode layer 50B and includes a thermosetting resin and a metal component, and a second Ni plated layer 71B provided on the second electrically conductive resin layer 60B. Tensile stress remains as internal stress inside the first Ni plated layer 71A and inside the second Ni plated layer 71B.