Multilayer Ceramic Capacitor End-Layer Structure for Field Relief
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Solution Overview
Problem
Existing multilayer ceramic capacitors face reliability issues due to electric field concentration at the ends of internal electrodes, which is exacerbated by the concentration of electric field at the ends of the internal electrodes in close proximity to the dielectric ceramic layer with ceramic paste for level difference elimination.
Innovation Solution
The multilayer ceramic capacitor design includes a multilayer body with dielectric ceramic layers and internal electrode layers, where the second internal electrode layer is opposed to the first internal electrode layer with a dielectric ceramic layer in between, and a second dielectric ceramic layer is positioned to overlap the first dielectric ceramic layer, reducing electric field concentration at the ends of the internal electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of the side margin is reduced to increase the area of internal electrode layers, then the capacitance is improved, but the electric field concentration at the ends of internal electrodes is exacerbated, degrading reliability
Solution Approach 1:
The patent applies local quality by introducing a second dielectric ceramic layer with different composition and properties specifically at the end portions of the multilayer body, while maintaining the original dielectric ceramic layer composition in the central capacitance-forming regions. This localized modification addresses electric field concentration at electrode ends without affecting the overall capacitance performance.
Solution Approach 2:
The second dielectric ceramic layer acts as an intermediary between the internal electrode layers at the end portions, modifying the electric field distribution in this critical region. This intermediate layer prevents direct electric field concentration between adjacent internal electrodes by providing a compositional buffer zone.
2Manufacturing precision
If ceramic paste for level difference elimination is applied to suppress level difference between overlapping and non-overlapping internal electrode portions, then the manufacturing precision is improved, but the electric field concentration at the ends of internal electrodes is increased, degrading reliability
Solution Approach 1:
The patent changes the compositional parameters of the dielectric ceramic layer at the end portions by introducing a second dielectric ceramic layer with different material composition. This parameter change modifies the electrical properties in the end region, reducing electric field concentration while maintaining the level difference elimination function achieved by the ceramic paste.
3Area of stationary object
If the area of internal electrode layers is increased by reducing side margin thickness, then the capacitance is improved, but the electric field concentration at internal electrode ends occurs more severely
Solution Approach 1:
The patent applies local quality by introducing a second dielectric ceramic layer with different composition and properties specifically at the end portions of the multilayer body, while maintaining the original dielectric ceramic layer composition in the central capacitance-forming regions. This localized modification addresses electric field concentration at electrode ends without affecting the overall capacitance performance.
Solution Approach 2:
The second dielectric ceramic layer acts as an intermediary between the internal electrode layers at the end portions, modifying the electric field distribution in this critical region. This intermediate layer prevents direct electric field concentration between adjacent internal electrodes by providing a compositional buffer zone.
Data Source
AI summary
A multilayer ceramic capacitor includes a second alloy portion including one metal element provided in a greatest amount among metal elements of an internal electrode layer, and one or more metal elements among a metal group including Sn, In, Ga, Zn, Bi, Pb, Cu, Ag, Pd, Pt, Ph, Ir, Ru, Os, Fe, V, and Y is provided between a second dielectric ceramic layer and a first internal electrode layer, and between a second dielectric ceramic layer and a second internal electrode layer, respectively.


