Multilayer Ceramic Capacitor Floating Electrode ESL Reduction

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Solution Overview

Problem

Multilayer ceramic capacitors face challenges in achieving high withstand voltage and low equivalent series inductance (ESL) simultaneously, which is crucial for reducing power current ripples in electronic devices.

Innovation Solution

A multilayer capacitor design featuring a capacitor body with alternately laminated dielectric layers and internal electrodes, including a floating electrode structure on the second dielectric layer, connected to external electrodes to enhance withstand voltage while maintaining low ESL properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional multilayer capacitor structure is used, then the manufacturing process is simple, but the withstand voltage is insufficient and ESL cannot be reduced effectively

Engineering Contradiction:
Improvewithstand voltageVSAvoidelectrode structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The internal electrodes are segmented into multiple groups (first internal electrodes connected to first external electrode, second internal electrodes connected to second external electrode, third internal electrodes connected to third external electrode). This segmentation allows independent optimization of each electrode group's configuration, enabling the reduction of ESL while maintaining high withstand voltage through the distributed capacitive structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from conventional two-terminal capacitor structure to a multi-terminal structure with electrodes extending in multiple spatial dimensions. The internal electrodes are arranged in alternating layers throughout the capacitor body, creating a three-dimensional distributed capacitance network that reduces inductance while maintaining voltage handling capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Object-generated harmful factors

If the capacitor structure is optimized for low ESL, then power current ripples are reduced, but the withstand voltage may be compromised

Engineering Contradiction:
Improvepower current ripplesVSAvoidwithstand voltage
Core Design Contradiction:
Object-generated harmful factorsVSReliability

Solution Approach 1:

The second internal electrodes act as intermediary elements between the first and third internal electrode groups. These intermediate electrodes create additional capacitive coupling paths that further reduce ESL and smooth power current ripples, while the distributed arrangement across multiple dielectric layers maintains the voltage distribution necessary for high withstand voltage performance.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the electrical parameters by introducing multiple internal electrode groups with different connections to external electrodes. This creates a distributed RC network effect that reduces the equivalent series inductance and filters power current ripples, while the overall capacitor structure maintains high breakdown voltage through the series connection of multiple dielectric layers.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS11640875B2Multilayer ceramic capacitor and board having the same mounted thereon
Publication Date: 2023.05.02 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11640875B2 patent drawing
  • US11640875B2 patent drawing
  • US11640875B2 patent drawing

AI summary

A multilayer capacitor includes a capacitor body including first and second dielectric layers and internal electrodes, and including first to sixth surfaces; first and second external electrodes disposed on the fifth and sixth surfaces; and third and fourth external electrodes disposed on the third and fourth surfaces. The internal electrodes include: a first internal electrode disposed on the first dielectric layer and connected to the first and second external electrodes; a second internal electrode disposed on the first dielectric layer and connected to the third external electrode; a third internal electrode disposed on the first dielectric layer and connected to the fourth external electrode; and a fourth internal electrode disposed on the second dielectric layer and overlapping at least a portion of the first to third internal electrodes.