Multilayer Ceramic Capacitor Floating Electrodes Warpage Strength
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in achieving high capacitance and maintaining warpage strength due to the miniaturization of electronic components, where the reduced size and increased integration lead to decreased spaces and potential strength issues.
Innovation Solution
The chip component design includes a capacitance forming part with floating electrodes and protective parts featuring dummy electrodes, which are strategically positioned within the ceramic body to enhance capacitance and warpage strength by alternating dielectric layers and internal electrodes, connected to external electrodes, and dummy electrodes that contribute to structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of multilayer ceramic capacitors is reduced for miniaturization, then integration density increases, but warpage strength decreases
Solution Approach 1:
The capacitor structure is segmented into multiple functional regions: capacitance forming parts with floating electrodes for high capacitance, and protective parts with dummy electrodes for structural support. This segmentation allows different parts of the same component to serve different functions, enabling miniaturization while maintaining warpage strength through the strategically placed dummy electrodes in the protective parts
Solution Approach 2:
Different regions of the ceramic body are given different local qualities: the capacitance forming parts have optimized electrode arrangements for electrical performance, while the protective parts have dummy electrodes specifically positioned to enhance mechanical strength and reduce warpage. This local differentiation allows the component to simultaneously achieve high integration density and maintained structural integrity
2Quantity of substance
If floating electrodes are used to achieve high capacitance, then capacitance increases, but structural complexity increases
Solution Approach 1:
The protective parts with dummy electrodes are extracted as separate functional units from the capacitance forming parts. The dummy electrodes are positioned only in the protective parts, not in the capacitance forming parts, thereby achieving structural support without unnecessarily complicating the capacitance-forming electrode structure. This extraction maintains high capacitance while managing overall structural complexity
3Strength
If dummy electrodes are added to protective parts, then warpage strength increases, but manufacturing complexity increases
Solution Approach 1:
The dummy electrodes in the protective parts are merged with the external electrode structure, allowing them to be formed simultaneously during the same manufacturing process. This integration means that while dummy electrodes are added to enhance warpage strength, they do not require separate manufacturing steps, thereby minimizing the increase in manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively increases capacitance while preventing strength decrease phenomena, improving withstand voltage characteristics and acoustic noise reduction, and ensuring reliable performance in high-density electronic applications.
Implementation Method 1
a plurality of first and second dielectric layers are alternately disposed
Data Source
AI summary
A chip component includes: a ceramic body including a capacitance forming part in which first and second dielectric layers are alternately disposed; and external electrodes disposed on both end surfaces of the ceramic body, wherein the capacitance forming part includes first and second internal electrodes spaced apart from each other on the first dielectric layers and exposed to the end surfaces of the ceramic body to thereby be connected to the external electrodes; and floating electrodes disposed on the second dielectric layers and overlapped with portions of the first and second internal electrodes, the ceramic body includes protective parts disposed between upper and lower surfaces thereof and the capacitance forming part and having third dielectric layers on which first and second dummy electrodes exposed to the end surfaces of the ceramic body are disposed, and the protective parts include third dummy electrodes disposed between the first and second dummy electrodes.