Multilayer Ceramic Capacitor Fluorine Barrier Moisture Ingress

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Solution Overview

Problem

Multilayer ceramic electronic components are susceptible to moisture ingress at the interface between the ceramic base body and outer electrodes, leading to solder splatter during the reflow process due to moisture in the conductive resin layer turning into steam.

Innovation Solution

Incorporating a fluorine layer between the ceramic base body and the conductive resin layer, or between the sintered metal layer and the conductive resin layer, to create a water-repellent barrier that prevents moisture ingress, thereby preventing solder splatter during soldering.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the outer electrode extends over the edges of the end surface to wrap around adjacent main surfaces for mounting, then the ease of operation is improved, but moisture ingress at the interface between the main surface and edge portion of the outer electrode occurs

Engineering Contradiction:

Improvemounting easeVSAvoidmoisture ingress

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

A fluorine-containing resin layer is introduced as an intermediary barrier between the conductive resin layer and the ceramic base body. This layer prevents moisture from penetrating along the interface between the outer electrode and the ceramic base body, while allowing the outer electrode to maintain its wrapping structure for easy mounting. The fluorine-containing resin layer specifically targets and blocks the moisture ingress path without interfering with the electrical or mechanical functionality.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The fluorine-containing resin layer functions as a thin film barrier that conformally coats the interface region. This thin film provides effective moisture protection while maintaining the flexibility and structural integrity of the outer electrode assembly. The layer is thin enough to not interfere with the wrapping structure but sufficient to block moisture penetration.

Inventive Principle:

Principle #30Flexible shells and thin films

2Reliability

If the conductive resin layer is disposed between the sintered electrode layer and the plating layer to improve reliability, then the reliability is improved, but solder splatter occurs during reflow due to moisture in the conductive resin layer

Engineering Contradiction:

Improveresistance against deformationVSAvoidsolder splatter

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The fluorine-containing resin layer acts as a protective intermediary between the conductive resin layer and the external environment. It prevents moisture from entering the conductive resin layer, thereby eliminating the source of steam generation during reflow soldering. The conductive resin layer can thus maintain its beneficial mechanical support function without causing solder splatter.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The fluorine-containing resin layer is applied in advance to prevent moisture ingress before the reflow soldering process. By pre-blocking the moisture penetration path, it prevents the harmful effect of solder splatter that would otherwise occur when moisture in the conductive resin layer vaporizes during heating.

Inventive Principle:

Principle #9Preliminary anti-action

3Reliability

If a fluorine layer is added between the ceramic base body and conductive resin layer to prevent moisture ingress, then the reliability is improved, but the device complexity increases

Engineering Contradiction:

Improvemoisture protectionVSAvoidlayer structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The fluorine-containing resin layer is implemented as a thin film that can be applied conformally to the ceramic base body surface. This thin film provides effective moisture protection while adding minimal structural complexity. The layer integrates seamlessly with the existing multilayer structure without requiring significant modifications to the manufacturing process.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The fluorine-containing resin layer forms a composite structure with the ceramic base body and conductive resin layer. This composite approach combines the moisture barrier properties of fluorine-containing resins with the electrical and mechanical functions of the existing layers, achieving enhanced reliability through material composition rather than complex structural design.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The fluorine layer effectively prevents moisture from entering the conductive resin layer, eliminating solder splatter issues during the reflow process and ensuring reliable mounting of the multilayer ceramic electronic components on substrates.

Implementation Method 1

Methodology Applied

Scientific EffectHydrophobic effect: Hydrophobe

Data Source

PatentUS9881741B2Multilayer ceramic electronic component

Publication Date: 2018.01.30 MURATA MFG CO LTD

AI summary

A multilayer ceramic capacitor includes a ceramic base body and is structured such that fluorine is present between the ceramic base body and a sintered metal layer or between a sintered metal layer and a conductive resin layer.