Multilayer Ceramic Capacitor Frame Structure for Vibration Damping
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Solution Overview
Problem
Multilayer ceramic capacitors generate acoustic noise and high-frequency vibrations that cause discomfort and degrade device performance, particularly in quiet environments and audio circuits, and can malfunction sensors in IT and industrial/vehicle components.
Innovation Solution
A multilayer ceramic electronic component with a capacitor body, metal frames, and an exterior insulating portion is designed, where the metal frames are connected to external electrodes with conductive adhesive and configured to absorb piezoelectric vibrations, reducing noise and high-frequency vibrations by altering the vibration transmission path and using an exterior insulating portion to mitigate external impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a multilayer capacitor is used for compact size and high capacity, then small-sized and high capacity are achieved, but acoustic noise and high-frequency vibrations are generated
Solution Approach 1:
A vibration-absorbing structure is introduced as an intermediary element between the multilayer capacitor and the circuit board. This structure includes a vibration-absorbing member that contacts the external electrodes of the capacitor and a vibration-absorbing layer that contacts the circuit board, creating a mediation path that absorbs piezoelectric vibrations before they reach the board and generate acoustic noise.
Solution Approach 2:
The invention converts the harmful piezoelectric vibrations into beneficial damping through the vibration-absorbing structure. The vibration-absorbing member and layer are designed to specifically absorb vibrations in certain directions while allowing vibrations in other directions, transforming the harmful acoustic noise generation into a controlled energy dissipation process.
2Volume of moving object
If the capacitor body is made compact, then small-sized is achieved, but vibration transmission to the board increases
Solution Approach 1:
The vibration-absorbing structure serves as a mediator between the compact capacitor body and the circuit board. The vibration-absorbing member contacts the external electrodes while the vibration-absorbing layer contacts the board, creating an intermediate damping path that reduces the transmission of vibration forces from the small capacitor body to the board.
Solution Approach 2:
The vibration-absorbing layer functions as a flexible damping element between the capacitor and the rigid circuit board. This thin film-like structure allows for vibration absorption through its flexible properties, reducing the transmission of mechanical forces while maintaining electrical insulation.
3Reliability
If piezoelectric vibration occurs at high frequency (20 kHz or higher), then capacitor function is maintained, but sensor malfunction occurs
Solution Approach 1:
The vibration-absorbing structure converts the high-frequency piezoelectric vibrations that cause sensor malfunction into absorbed energy through damping. The structure is designed to absorb vibrations in specific directions while maintaining capacitor functionality, transforming the harmful high-frequency vibrations into beneficial energy dissipation that prevents sensor interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces acoustic noise and high-frequency vibrations, improving device performance and preventing sensor malfunctions, with a comparative example showing a two-fold reduction in acoustic noise from 41.0 dBA to 18.9 dBA.
Implementation Method 1
Since the dielectric layer has piezoelectricity, a piezoelectric phenomenon may occur between internal electrodes when a direct or alternating voltage is applied to the multilayer capacitor
Implementation Method 2
the metal frames are connected to external electrodes with conductive adhesive and configured to absorb piezoelectric vibrations, reducing noise and high-frequency vibrations
Data Source
AI summary
A multilayer ceramic electronic component includes a multilayer capacitor including a capacitor body, and first and second external electrodes disposed on both side surfaces of the capacitor body, respectively; first and second metal frames disposed on both side surfaces and upper and lower surfaces of the multilayer capacitor; and an exterior insulating portion disposed to surround upper surfaces of the multilayer capacitor and the first and second metal frames. A shortest distance from an upper end of the exterior insulating portion to the external electrodes is defined as G1, a shortest distance from a lower end of the exterior insulating portion to the external electrodes is defined as G2, a maximum distance from upper ends of the external electrodes to lower ends is defined as T, and G1, G2, and T satisfy G1≤G2≤T/2.