MLCC Base Electrode Glass Protrusions for Plating Adhesion
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Solution Overview
Problem
Insufficient adhesion between the base electrode layer and the plated layer in multilayer ceramic capacitors leads to peeling issues.
Innovation Solution
Incorporating a base electrode layer with a Cu region and a glass region including Si as a main component, where the glass region protrudes from the Cu region, enhancing adhesion with a plated layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a base electrode layer with a Cu region is used, then electrical conductivity is improved, but adhesion with the plated layer deteriorates
Solution Approach 1:
The base electrode layer is designed with non-uniform local composition: a Cu region providing electrical conductivity and a glass region (with Si as main component) providing adhesion. The glass region protrudes from the Cu region to specifically enhance bonding with the plated layer, while the Cu region maintains electrical functionality. This local differentiation resolves the contradiction between conductivity and adhesion.
Solution Approach 2:
The base electrode layer is constructed as a composite material system combining Cu (for conductivity) and glass containing Si (for adhesion). This composite structure allows simultaneous achievement of electrical conductivity through the Cu region and strong adhesion through the glass region that protrudes into the plated layer, preventing peeling while maintaining electrical performance.
Data Source
AI summary
A multilayer ceramic capacitor includes a multilayer body including internal electrode layers and internal dielectric layers alternatively laminated, main surfaces on both sides in a lamination direction, end surfaces on both sides in a length direction intersecting the lamination direction, and lateral surfaces on both sides in a width direction intersecting the lamination direction and the length direction, and external electrodes on the end surfaces of the multilayer body. The external electrodes each include a base electrode layer including a Cu region including Cu as a main component and at least one glass region including Si as a main component, and a plated layer covering the base electrode layer. On a surface of the base electrode layer covered by the plated layer, at least one glass region protrudes from the Cu region.