Multilayer Ceramic Capacitor Grain Size Layout for Insulation Breakdown

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Multilayer ceramic electronic components face issues with insulation breakdown due to excessive current flow and electric field concentration, particularly at the ends of internal electrode layers where the dielectric sheets are thinned.

Innovation Solution

The multilayer ceramic electronic components are designed with a multilayer body that includes stacked dielectric layers and internal electrode layers, where the particle size of ceramic on the lateral surfaces and end surfaces of the inner layer portion is smaller than in the central portion, reducing the voltage per grain boundary and minimizing insulation breakdown.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the dielectric sheets are thinned to achieve downsizing and high-performance, then the component size is reduced and layer count is increased, but the grain boundaries become sparse and electrical resistance decreases leading to insulation breakdown

Engineering Contradiction:
Improvecomponent sizeVSAvoidinsulation resistance
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent applies local quality by forming a stepped structure where the dielectric sheet thickness varies in different regions. Specifically, a first dielectric sheet has a first thickness in a first region and a second thickness in a second region, creating localized thickness variations that generate steps to prevent ceramic flow and maintain grain boundary density in critical areas, thereby preserving insulation resistance while allowing overall thinning for downsizing

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent segments the dielectric sheet into multiple regions with different thicknesses (first region with first thickness, second region with second thickness). This segmentation creates distinct zones that serve different functions: thinner regions reduce overall component volume while thicker regions maintain structural integrity and prevent ceramic flow, resolving the contradiction between downsizing and maintaining insulation resistance

Inventive Principle:
Principle #1Segmentation

2Productivity

If the dielectric sheets are thinned and multi-layered, then productivity and capacitance are improved, but steps are generated at edges of internal electrode layers causing electric field concentration and insulation breakdown

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidinsulation resistance
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent applies local quality by creating a stepped structure where dielectric sheet thickness varies locally to compensate for the steps generated at internal electrode layer edges. The first dielectric sheet has different thicknesses in different regions, and a second dielectric sheet is added to specific regions to fill the steps, thereby eliminating electric field concentration at electrode edges while maintaining the thinning and multi-layering structure for high productivity and capacitance

Inventive Principle:
Principle #3Local quality

3Quantity of substance

If the dielectric sheets are thinned, then the component achieves high-density stacking, but excessive current flows through the thinned regions causing electric field concentration and insulation breakdown

Engineering Contradiction:
Improvelayer densityVSAvoidinsulation resistance
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent applies local quality by creating regions with different dielectric sheet thicknesses. The first dielectric sheet has a first thickness in a first region and a second thickness in a second region, generating steps that prevent ceramic flow and maintain adequate grain boundary density. This localized thickness variation allows high-density stacking in thinner regions while preventing excessive current flow and electric field concentration in thicker regions, thereby maintaining insulation resistance

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20250029784A1Multilayer ceramic electronic component
Publication Date: 2025.01.23 MURATA MFG CO LTD
  • US20250029784A1 patent drawing
  • US20250029784A1 patent drawing
  • US20250029784A1 patent drawing

AI summary

In a multilayer ceramic electronic component, the particle size of the ceramic on the first lateral surface of the inner layer portion is smaller than that in the central portion of the inner layer portion in the width direction. The particle size of the ceramic on the second lateral surface of the inner layer portion smaller than that in the central portion of the inner layer portion in the width direction. The particle size of the ceramic at the end of the second internal electrode layer on the first end surface of the inner layer portion is smaller than that in the central portion of the inner layer portion. The particle size of the ceramic at the end of the first internal electrode layer on the second end surface of the inner layer portion is smaller than that in the central portion of the inner layer portion.