Multilayer Ceramic Capacitor Horizontal Electrode Mounting
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Solution Overview
Problem
Existing multilayer ceramic capacitors face limitations in miniaturization and ultrahigh capacitance due to the perpendicular disposition of internal electrodes, making it difficult to mount them horizontally on a mounting surface, which restricts their application in certain electronic devices.
Innovation Solution
A multilayer ceramic capacitor design featuring internal electrodes with overlapping lead portions exposed on one surface, connected to external electrodes with terminal portions extending perpendicularly, and covered by insulating layers, allowing horizontal electrode disposition and improved mounting flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If internal electrodes are disposed perpendicularly to the mounting surface to achieve miniaturization and increased capacitance, then the capacitance and size are improved, but the mounting flexibility is worsened as horizontal mounting becomes difficult
Solution Approach 1:
The patent changes the orientation of internal electrodes from perpendicular to horizontal relative to the mounting surface. This dimensional reorientation allows the capacitor to be mounted horizontally on circuit boards, providing mounting flexibility while maintaining the increased capacitance achieved through multiple stacked dielectric layers and overlapping electrode configurations.
Solution Approach 2:
The patent inverts the conventional electrode arrangement by exposing lead portions of internal electrodes to the side surface rather than the top surface, and by forming external electrodes that extend to the mounting surface. This inverted configuration enables horizontal mounting orientation, resolving the contradiction between capacitance optimization and mounting versatility.
2Quantity of substance
If the number of stacked dielectric layers is increased to achieve ultrahigh capacitance, then the capacitance is improved, but the device complexity increases
Solution Approach 1:
The patent merges multiple dielectric layers with internal electrodes into a compact stacked configuration where lead portions of adjacent electrodes overlap. This merging approach achieves ultrahigh capacitance within a small volume while the overlapping electrode design simplifies the connection structure, reducing overall device complexity despite the increased number of layers.
Solution Approach 2:
The patent implements a nested structure where internal electrodes are disposed within the ceramic body with their lead portions extending and overlapping on the surface. This nesting arrangement allows multiple electrode pairs to be compactly integrated, achieving high capacitance without proportionally increasing external dimensions or structural complexity.
3Adaptability or versatility
If internal electrodes are exposed to the same surface for horizontal mounting, then the mounting flexibility is improved, but the electrode alignment complexity increases
Solution Approach 1:
The patent applies local quality by forming external electrodes with specific configurations at different locations: lead connection portions on the top surface connected to exposed lead portions, and external terminal portions extending to the mounting surface. This localized electrode design simplifies the alignment process while enabling horizontal mounting, as each electrode region performs its specific function without requiring complex overall alignment.
Data Source
AI summary
There are provided a multilayer ceramic capacitor and a manufacturing method thereof, the multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes; first and second external electrodes; and a first insulating layer.