Multilayer Ceramic Capacitor Insulating Layer Design for Crack Prevention
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Solution Overview
Problem
Conventional multilayer ceramic capacitors experience mechanical weakness and cracking due to stress-induced warping when mounted on boards, as the end portions of terminal electrodes with low solder wettability insulating layers fail to provide sufficient strength against applied stress.
Innovation Solution
The electronic component assembly incorporates an insulating layer that covers the main surface of the multilayer ceramic capacitor, extending over the external electrodes, with both end portions of the insulating layer positioned outside the end surfaces of the capacitor, enhancing mechanical strength and preventing short circuits by reducing stress concentration and ion migration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the end portions of terminal electrodes are covered with electric insulating layers having low solder wettability, then short circuits between adjacent capacitors are prevented, but mechanical strength against stress and crack resistance deteriorate
Solution Approach 1:
The insulating layer is designed with non-uniform thickness: thicker at the end portions (providing electrical insulation and short circuit prevention) and thinner at the central portion (maintaining mechanical strength and solder joint integrity). This local variation in thickness allows the same component to simultaneously achieve both electrical isolation and mechanical robustness.
Solution Approach 2:
The patent changes the thickness parameter of the insulating layer along its length. By controlling the thickness distribution (thicker at ends, thinner at center), the design optimizes both electrical insulation performance and mechanical strength, resolving the contradiction between these two requirements.
Data Source
AI summary
An electronic component assembly includes an electronic component and a mounting board. The electronic component includes a stacked body, a pair of external electrodes provided on both end surfaces of the stacked body, and an insulating layer entirely covering a first main surface of the stacked body. The mounting board includes a board main body having a mounting surface, and land electrodes on the mounting surface. The first main surface of the electronic component faces the mounting surface of the mounting board, and the pair of external electrodes are mounted on the land electrodes with solder. Both end portions of the insulating layer in the length direction of the electronic component are located on the outer side relative to both end surfaces of the stacked body at least in a cross section taken at the center in the width direction.