Multilayer Ceramic Capacitor Insulating Portion Plating Layer
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges with low mechanical strength and electrical connection reliability due to weak bonding between conductor and insulating layers, which can lead to peeling and insufficient connections, especially when the conductor thickness decreases.
Innovation Solution
The capacitors incorporate a configuration where a conductor layer is covered with an insulating portion made of ceramic, which is then bonded with an underlayer external electrode layer, enhancing moisture resistance and mechanical strength through a plating layer, ensuring reliable electrical connections even with thinner conductor layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If insulating portion is formed between conductor layer and underlayer external electrode layer, then moisture resistance is improved, but mechanical strength of external electrode deteriorates
Solution Approach 1:
The insulating portion is selectively formed only in specific regions where moisture penetration is most likely to occur, rather than covering the entire conductor layer. This localized approach provides moisture protection at critical interfaces while preserving bonding areas where the conductor layer contacts the underlayer external electrode layer, thus maintaining mechanical strength.
Solution Approach 2:
The end surface structure is segmented into multiple functional zones: conductor layer regions for electrical connection, insulating portion regions for moisture protection, and overlapping regions where both functions coexist. This segmentation allows the underlayer external electrode layer to bond with both the conductor layer and insulating portion at different locations, resolving the contradiction between moisture resistance and mechanical strength.
2Length of moving object
If conductor layer thickness is decreased, then device size is reduced, but electrical connection reliability deteriorates
Solution Approach 1:
The solution moves from relying solely on conductor layer thickness for electrical connection reliability to utilizing the vertical stacking dimension. Multiple layers (conductor layer, insulating portion, underlayer external electrode layer, plating layer) are stacked vertically to provide redundant bonding interfaces and electrical pathways, compensating for the reduced thickness of individual conductor layers.
Solution Approach 2:
The electrical connection structure is transformed into a composite multi-layer system where different materials (conductive materials in the conductor layer, ceramic materials in the insulating portion, and plating materials) work together. The underlayer external electrode layer and plating layer form a composite structure that provides both mechanical bonding and electrical conductivity, ensuring reliability even when the conductor layer is thin.
Data Source
AI summary
A multilayer ceramic capacitor includes a capacitive element including a ceramic layer, a first internal electrode layer, and a second internal electrode layer, the capacitive element including a first and second principal surfaces, first and second side surfaces, and first and second end surfaces. The first and second internal electrode layers respectively extend to the first and second end surfaces, at least a portion of each of the first and second end surfaces are covered with a conductor layer, a portion of the conductor layer is covered with an insulating portion, at least a portion of the conductor layer and at least a portion of the insulating portion are covered with the underlayer external electrode layer when viewed from the first end surface and the second end surface, and at least a portion of the underlayer external electrode layer is covered with a plating layer.