Multilayer Ceramic Capacitor Insulation Layout for Corner Stability

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Solution Overview

Problem

Conventional multilayer ceramic capacitors face challenges in controlling the formation of side-gap insulation layers, leading to insufficient connection between internal and terminal electrodes, especially when downsized, and increased risk of short circuits due to insulation layer release from corner parts.

Innovation Solution

The electronic component features an insulation layer that covers multiple side faces continuously along the circumference direction with consistent properties, preventing moisture ingress and ensuring reliable connection between internal and terminal electrodes, even in compact designs, using a rolling transfer method to form the insulation layer without covering unnecessary areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the side-gap insulation layer is formed using a coating method to cover the side face, then the insulation layer can be formed, but the exposed end of the internal electrode layer may result in insufficient connection with the terminal electrode

Engineering Contradiction:
Improveconnection reliabilityVSAvoidinsulation layer positioning precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The insulation layer is segmented into different regions: a first insulation layer formed on the side face and a second insulation layer formed on the end face. This segmentation allows precise control over where the insulation layer is applied, ensuring that the internal electrode layer remains exposed on the end face for reliable terminal electrode connection while still providing insulation on the side face.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the element body receive different insulation treatments. The side face receives the first insulation layer for electrical insulation, while the end face receives the second insulation layer that specifically protects the boundary without covering the internal electrode layer exposure area, ensuring local optimization of both insulation and connectivity.

Inventive Principle:
Principle #3Local quality

2Reliability

If the insulation layer is formed only to the side face, then the connection between internal and terminal electrodes is maintained, but the insulation layer is easily released from the corner part

Engineering Contradiction:
Improveconnection reliabilityVSAvoidinsulation layer stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The first insulation layer on the side face and the second insulation layer on the end face are merged to form a continuous insulation coverage that extends around the corner part. This combined structure prevents the insulation layer from being released at the corner, enhancing stability while maintaining the exposure of the internal electrode layer on the end face for reliable connection.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The second insulation layer is positioned to extend from the end face onto the side face, nesting with and reinforcing the first insulation layer. This nested configuration creates a more stable, interlocked insulation structure at the corner region that resists release while preserving electrode connectivity.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Volume of moving object

If the element body is downsized, then the electronic component achieves compact size, but it becomes difficult to form the insulation layer without covering the exposed end of the internal electrode layer

Engineering Contradiction:
Improveelement body sizeVSAvoidinsulation layer formation precision
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

By segmenting the insulation layer into a first layer on the side face and a second layer on the end face, the invention enables precise control of insulation layer formation even in downsized elements. The segmented approach allows the insulation layer to be applied accurately without covering the internal electrode layer exposure, maintaining manufacturing precision despite reduced element dimensions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The local quality principle allows different regions of the downsized element to receive tailored insulation treatment. The second insulation layer on the end face is specifically designed to protect the boundary area while leaving the internal electrode layer exposure intact, enabling precise insulation formation in compact elements where margin for error is minimal.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12374494B2Electronic component
Publication Date: 2025.07.29 TDK CORP
  • US12374494B2 patent drawing
  • US12374494B2 patent drawing
  • US12374494B2 patent drawing

AI summary

The electronic component includes an element body 4 having a plurality of side faces 5a to 5d along a circumference direction. The element body 4 includes insulation layers 16a to 16d covering the plurality of side faces 5a to 5d in a continuous manner along a circumference direction; and properties (a pore ratio, dielectric particle sizes, and so on) of the insulation layers 16a to 16d are substantially consistent along a circumference direction.