Multilayer Ceramic Capacitor Insulation for Dense PCB Mounting
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Solution Overview
Problem
Existing multilayer ceramic capacitors face issues with short-circuiting when densely mounted on circuit boards due to external electrodes on the side surfaces, leading to reduced capacitance and reliability.
Innovation Solution
The multilayer ceramic capacitors are designed with protective layers made of insulating ceramic material covering the side surfaces and terminal side surfaces of the external electrodes, along with chamfered edges and underlayers to enhance electrical reliability and allow for high-density mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If external electrodes are provided on side surfaces for high-density mounting, then mounting density is improved, but short-circuiting between adjacent capacitors occurs reducing reliability
Solution Approach 1:
An insulating protective layer is introduced as an intermediary substance between adjacent external electrodes on side surfaces. This protective layer prevents direct contact and short-circuiting between capacitors while allowing high-density mounting, thus resolving the contradiction between mounting density and electrical reliability.
2Reliability
If protective layers are added to prevent short-circuiting, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The protective layer is formed by applying insulating material during the same sintering process used to create the ceramic body and external electrodes. By merging the protective layer formation with the existing sintering step, the patent adds reliability functionality without significantly increasing manufacturing complexity.
3Reliability
If chamfered edges and underlayers are added to enhance reliability, then electrical reliability is improved, but manufacturing steps increase
Solution Approach 1:
Chamfered edges are formed on the external electrodes before applying the protective layer. This preliminary action creates a favorable surface geometry that enhances the effectiveness of the protective layer in preventing short-circuiting, while the chamfering step can be integrated into existing electrode formation processes.
Data Source
AI summary
A multilayer ceramic electronic component includes a base component, a first external electrode, a second external electrode, and a protective layer. The base component includes ceramic layers and internal electrode layers alternately stacked on one another and includes a first surface, a second surface, a first end face, a second end face, a first side surface, and a second side surface. The internal electrode layers are exposed on the first and second side surfaces and on the first or second end face. Each of the first and second external electrodes extends to at least one of the first or second surface from the first or second end face and includes first and second terminal side surfaces. The protective layer contains a ceramic material and covers the first and second side surfaces, and the first and second terminal side surfaces of each of the first and second external electrodes.