MLCC Electrode-Dielectric Interface for Breakdown Voltage Stability

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Solution Overview

Problem

The challenge is to improve the breakdown voltage (BDV) characteristics and capacitance per unit volume of multilayer ceramic capacitors while ensuring reliable electrode connectivity, especially when dielectric layers or internal electrodes are formed to be thin for miniaturization and high capacitance.

Innovation Solution

A multilayer electronic component design that includes a secondary phase containing aluminum (Al) at the interface between internal electrodes and dielectric layers, with a specific area ratio of 0.03% to 0.40% to enhance connectivity and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the thickness of dielectric layers or internal electrodes is reduced to achieve miniaturization and higher capacitance, then capacitance per unit volume is improved, but electrode connectivity and breakdown voltage characteristics deteriorate

Engineering Contradiction:
Improvecapacitance per unit volumeVSAvoidelectrode connectivity
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent applies local quality by introducing a secondary phase specifically at the interface between internal electrodes and dielectric layers, where connectivity issues occur. This localized modification ensures that the secondary phase reinforces electrode connectivity precisely where needed without affecting other regions of the component, thereby resolving the connectivity problem caused by thinning while maintaining overall miniaturization benefits

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The secondary phase acts as an intermediary substance between the internal electrodes and dielectric layers. This intermediate layer improves interfacial bonding and electrical connectivity, mediating the interaction between electrodes and dielectric material to prevent connectivity failures that would otherwise occur in miniaturized structures with reduced thickness

Inventive Principle:
Principle #24Intermediary (Mediator)

2Quantity of substance

If the thickness of dielectric layers or internal electrodes is reduced to achieve miniaturization and higher capacitance, then capacitance per unit volume is improved, but breakdown voltage characteristics deteriorate

Engineering Contradiction:
Improvecapacitance per unit volumeVSAvoidbreakdown voltage
Core Design Contradiction:
Quantity of substanceVSStrength

Solution Approach 1:

The secondary phase is locally introduced at the electrode-dielectric interfaces to strengthen the electrical insulation and improve breakdown voltage characteristics. This localized reinforcement addresses the specific weakness created by thinning without requiring overall thickening of the structure, thus maintaining high capacitance per unit volume while improving voltage withstand capability

Inventive Principle:
Principle #3Local quality

3Reliability

If the area ratio of secondary phase is increased to improve electrode connectivity, then reliability is improved, but capacitance per unit volume decreases

Engineering Contradiction:
Improveelectrode connectivityVSAvoidcapacitance per unit volume
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent optimizes the area ratio parameter of the secondary phase to a specific range (0.01% to 0.50%) to achieve the best balance between electrode connectivity and capacitance per unit volume. This parameter optimization ensures sufficient secondary phase presence for reliable connectivity while limiting its area to minimize impact on capacitance density, resolving the trade-off between reliability and capacitance

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS12322556B2Multilayer electronic component
Publication Date: 2025.06.03 SAMSUNG ELECTRO MECHANICS CO LTD
  • US12322556B2 patent drawing
  • US12322556B2 patent drawing
  • US12322556B2 patent drawing

AI summary

A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction and a cover portion disposed on one surface and the other surface of the capacitance forming portion in the first direction, and external electrodes disposed on the body, wherein a secondary phase including Al is disposed at an interface between the internal electrode and the dielectric layer, and the ratio of an area occupied by the secondary phase to an area of the capacitance forming portion is 0.03% or more and 0.40% or less.