Multilayer Ceramic Component Interface Structure for Thin Dielectric Life
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Solution Overview
Problem
Multilayer ceramic electronic components face challenges in achieving high service life and sufficient bias properties due to the susceptibility of thinner dielectric layers to damage under high electric field stress, which is exacerbated by the addition of additive elements that can lead to local concentration and reduced performance.
Innovation Solution
Incorporating intermediate regions with a higher content of additive elements and copper between dielectric and internal electrode layers, using compounds with a perovskite structure and base metal elements, to prevent local concentration of additive elements and enhance service life and bias properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
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If dielectric layers are made thinner to support size reduction and capacity increase, then the component size is reduced and capacity is increased, but the dielectric layers become more susceptible to damage under high electric field stress, shortening service life
Solution Approach 1:
The patent applies local quality by creating intermediate regions with distinct compositional characteristics between the dielectric layers and internal electrode layers. These intermediate regions have higher additive element content and higher copper content compared to adjacent layers, providing localized protection at the interface where electric field stress is most intense, while the bulk dielectric layers maintain their thin structure for size reduction and capacity increase.
Data Source
AI summary
A multilayer ceramic electronic component includes: multiple dielectric layers laminated along a first axis; multiple internal electrode layers respectively placed along the first axis between the adjacent pairs of the dielectric layers; and intermediate regions placed between the dielectric layers and the internal electrode layers, respectively; wherein the dielectric layers contain a compound expressed by the general formula ABO3-α (0≤α≤1) and having a perovskite structure, as well as an additive element; the internal electrode layers contain a base metal element as the main component, as well as copper; the intermediate regions contain the additive element as well as copper; and the additive element encompasses one or more types selected from holmium, yttrium, samarium, dysprosium, europium, gadolinium, terbium, erbium, thulium, and ytterbium.