Multilayer Ceramic Capacitor Interface Layer for Electrode Continuity
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Solution Overview
Problem
The challenge in manufacturing multilayer ceramic capacitors is the discontinuity at contact points of the internal electrode layer with the secondary phase due to the sintering promoting effect of the liquid phase sintering, leading to a decrease in the continuity modulus and potential internal defects such as cracks.
Innovation Solution
Incorporating a layer with additive elements like Au, Pt, Cu, Fe, Cr, Zn, and In at the interface between the dielectric and internal electrode layers, which suppresses the sintering promoting effect and maintains the continuity modulus by pinning at the interface, thereby preventing spheroidization and discontinuity of the internal electrode layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If liquid phase sintering is used to promote sintering, then sintering speed and density improvement are enhanced, but discontinuity occurs at contact points of the internal electrode layer with the secondary phase, leading to decreased continuity modulus
Solution Approach 1:
The patent applies local quality by introducing a layer containing additive elements (such as Au, Pt, Cu, Fe, Cr, Zn, or In) specifically at the interface region between the internal electrode layer and the secondary phase. This localized modification allows the bulk material to benefit from liquid phase sintering while the interface region maintains continuity, thus resolving the contradiction between sintering speed and continuity modulus.
Solution Approach 2:
The additive element layer acts as an intermediary between the internal electrode layer and the secondary phase. It mediates the interaction by preventing direct contact that would cause discontinuity, while still allowing the sintering process to proceed effectively. This intermediary layer maintains the continuity modulus while enabling the benefits of liquid phase sintering.
2Reliability
If liquid phase sintering is used to improve densification, then internal defects such as cracks are suppressed, but discontinuity at contact points reduces the continuity modulus
Solution Approach 1:
The patent applies local quality by introducing a layer containing additive elements (such as Au, Pt, Cu, Fe, Cr, Zn, or In) specifically at the interface region between the internal electrode layer and the secondary phase. This localized modification allows the bulk material to benefit from liquid phase sintering while the interface region maintains continuity, thus resolving the contradiction between sintering speed and continuity modulus.
Solution Approach 2:
The additive element layer acts as an intermediary between the internal electrode layer and the secondary phase. It mediates the interaction by preventing direct contact that would cause discontinuity, while still allowing the sintering process to proceed effectively. This intermediary layer maintains the continuity modulus while enabling the benefits of liquid phase sintering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses the decrease in continuity modulus and internal defects, enhancing the structural integrity and performance of the multilayer ceramic capacitors by ensuring better contact and sintering control between the dielectric and internal electrode layers.
Implementation Method 1
a layer including an additive element including one or more of Au, Pt, Cu, Fe, Cr, Zn, and In, at a region contacting the secondary phase at the interface
Implementation Method 2
discontinuity is likely to occur at contact points of the internal electrode layer with the secondary phase due to the sintering promoting effect of the liquid phase sintering
Data Source
AI summary
A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers including Ni as a main phase are alternately stacked. At least one of the plurality of dielectric layers includes a secondary phase including Si, at an interface between the at least one of the plurality of dielectric layers and one of the plurality of internal electrode layers next to the at least one of the plurality of dielectric layers. The one of the plurality of internal electrode layers includes a layer including an additive element including one or more of Au, Pt, Cu, Fe, Cr, Zn, and In, at a region contacting the secondary phase at the interface.