MLCC Interface Phase Control for Capacitance and Breakdown Voltage
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Solution Overview
Problem
The challenge of miniaturizing multilayer ceramic capacitors while maintaining high capacitance and ensuring reliable electrode connectivity and breakdown voltage characteristics is addressed by incorporating a secondary phase of Al at the interface between internal electrodes and dielectric layers, with a specific area ratio of 0.03% to 0.40% to enhance thermal and electrical properties.
Innovation Solution
A multilayer electronic component design featuring a secondary phase of Al at the interface between internal electrodes and dielectric layers, with a controlled area ratio, to improve connectivity and breakdown voltage, even when dielectric and internal electrodes are thin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of internal electrodes or dielectric layers is reduced to achieve miniaturization and high capacitance, then capacitance per unit volume is improved, but electrode connectivity and breakdown voltage characteristics deteriorate
Solution Approach 1:
The patent applies local quality by introducing a secondary phase specifically at the interface between internal electrodes and dielectric layers, rather than uniformly throughout the structure. This localized modification improves electrode connectivity and breakdown voltage characteristics at critical interfaces while maintaining thin overall dimensions for miniaturization and high capacitance density.
Solution Approach 2:
The patent employs composite materials by combining the primary dielectric layer with a secondary phase containing Al, Ni, Cu, or their alloys at the interface regions. This composite structure leverages the complementary properties of different materials to simultaneously achieve thin dimensions for high capacitance density and enhanced interfacial properties for reliable electrode connectivity and breakdown voltage.
2Volume of moving object
If dielectric layers or internal electrodes are formed to be thin for miniaturization, then device size is reduced, but difficulty in securing electrode connectivity increases
Solution Approach 1:
The patent addresses the connectivity issue in miniaturized devices by applying local quality through secondary phase introduction at electrode-dielectric interfaces. This localized enhancement ensures reliable electrode connectivity at critical points without requiring increased overall thickness, thereby maintaining miniaturization while improving connectivity reliability.
Solution Approach 2:
The secondary phase acts as an intermediary between the internal electrodes and dielectric layers, facilitating improved interfacial contact and connectivity. This intermediary layer mediates the interaction between electrodes and dielectric material, ensuring reliable electrical connection even when overall dimensions are reduced for miniaturization.
Data Source
AI summary
A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction and a cover portion disposed on one surface and the other surface of the capacitance forming portion in the first direction, and external electrodes disposed on the body, wherein a secondary phase including Al is disposed at an interface between the internal electrode and the dielectric layer, and the ratio of an area occupied by the secondary phase to an area of the capacitance forming portion is 0.03% or more and 0.40% or less.