Multilayer Ceramic Capacitor Interposer Structure for Crack Prevention
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Solution Overview
Problem
Multilayer ceramic capacitors face stress concentration issues due to contact with an interposer, which can lead to cracks in the capacitor main body when stress is applied to the mounting board.
Innovation Solution
Incorporating an insulating resin film in the gap between the board mounting surface of the capacitor main body and the capacitor-facing surface of the interposer, which reduces direct contact and stress concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an interposer is provided on the side of the capacitor main body to reduce acoustic noise, then acoustic noise is reduced, but stress concentration occurs in the contact portion leading to cracks
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the interposer and the capacitor main body. This resin layer acts as a mediator that distributes the stress applied by the interposer over a larger area of the capacitor main body, preventing stress concentration at the contact portion while maintaining the acoustic noise reduction function of the interposer.
2Strength
If the interposer directly contacts the capacitor main body to provide support, then structural support is improved, but stress concentration occurs at the contact portion
Solution Approach 1:
The resin layer serves as an intermediary between the interposer and capacitor main body, allowing the interposer to provide structural support while the resin distributes the applied stress over a wider area, preventing stress concentration at the contact interface.
Solution Approach 2:
The resin layer changes the mechanical parameters at the contact interface by providing a compliant, stress-distributing medium rather than a rigid direct contact, thereby reducing peak stress while maintaining support functionality.
Data Source
AI summary
A multilayer ceramic capacitor includes a capacitor main body including a multilayer body in which dielectric layers and internal electrode layers are alternately laminated, and external electrodes respectively on two end surfaces of the multilayer body and connected to the internal electrode layers, an interposer at a board mounting surface of the capacitor main body, and an insulating resin film in a gap between the board mounting surface and a capacitor-facing surface of the interposer which is opposed to the board mounting surface.