Multilayer Ceramic Capacitor Interposer Layout for Crack Resistance
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Solution Overview
Problem
Multilayer ceramic capacitors face stress concentration issues due to bending or mounting stress, which can lead to cracks when interposers are bonded to the capacitor main body, causing concentrated pressure on the inner edge portions.
Innovation Solution
The design incorporates interposers with bonding surfaces featuring inner edge portions that are longer than the width of the multilayer body, reducing stress concentration by distributing it more evenly across the surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If interposers are bonded to the capacitor main body with conventional bonding surfaces, then the capacitor can be mounted on a substrate, but stress concentration occurs at the inner edge portions of the bonding surface, leading to potential cracks in the capacitor main body
Solution Approach 1:
The bonding surface is designed with non-uniform edge portions having different lengths. Specifically, the edge portions at the inner sides (opposite to each other) are made longer than the edge portions at the outer sides. This local variation in geometry distributes the stress more evenly across the bonding interface, preventing stress concentration at specific points and thereby improving crack resistance of the capacitor main body.
2Stress or pressure
If the inner edge portions of the bonding surface are made longer, then stress concentration is reduced, but the bonding surface area increases
Solution Approach 1:
Instead of uniformly increasing the entire bonding surface area, the invention selectively extends only the inner edge portions. This localized modification achieves stress distribution improvement while minimizing the overall increase in bonding surface area, thus maintaining compact device dimensions.
Data Source
AI summary
A multilayer ceramic capacitor includes a capacitor main body including a multilayer body and external electrodes, the multilayer body including dielectric layers and internal electrode layers stacked alternately, each of the external electrodes being provided on an end surface in a length direction of the multilayer body and being connected to the internal electrode layers, and two interposers on one surface in a stacking direction of the capacitor main body and spaced apart from each other in the length direction, the interposers including bonding surfaces bondable to the one surface of the capacitor main body and including inner edge portions which are opposite to each other and each having a length longer than a length in a width direction of the multilayer body.