Multilayer Ceramic Capacitor Interposer Grooves Solder Resist
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Solution Overview
Problem
Multilayer ceramic capacitors in mobile devices experience mechanical distortion due to voltage variations, causing vibration that is transmitted to circuit boards, leading to audible noise and challenges in high-density mounting designs.
Innovation Solution
An electronic component with a substrate featuring grooves in its side surfaces to reduce the amount of solder that climbs and wets onto the capacitor, using an interposer with connecting conductors spaced from the side surfaces to prevent vibration transmission and burr formation, allowing for easier structural design and mounting with equivalent strength and electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an interposer is used to prevent vibration transmission, then vibration sound is reduced, but the land pattern requires changes which are difficult to achieve for high-density mounting circuit boards
Solution Approach 1:
The patent introduces a solder resist layer as an intermediary between the solder and the multilayer ceramic capacitor. This solder resist layer prevents direct contact between the solder and the capacitor body, thereby blocking the transmission path of vibration while maintaining the existing land pattern design for high-density mounting.
Solution Approach 2:
The patent segments the bonding interface by introducing a distinct solder resist layer that separates the solder from the capacitor. This segmentation allows the solder to bond to the interposer electrodes without directly contacting the capacitor, thus preventing vibration transmission while preserving manufacturing simplicity.
2Strength
If solder is applied to bond the interposer to the circuit board, then mounting strength is achieved, but solder climbs and wets onto the multilayer ceramic capacitor transmitting vibration
Solution Approach 1:
The solder resist layer serves as a mediator that allows solder to perform its bonding function while preventing it from contacting the capacitor. The solder bonds to the interposer electrodes through the solder resist layer, maintaining mounting strength while the solder resist layer blocks the harmful vibration transmission path.
Solution Approach 2:
The patent extracts the harmful function of solder (vibration transmission) while preserving its useful function (mounting strength). By applying solder resist to the capacitor surface, the solder is prevented from climbing onto the capacitor, thus removing the harmful vibration transmission pathway while maintaining adequate bonding strength through proper solder application.
3Reliability
If the arrangement direction of lower electrodes and upper electrodes in the interposer cross each other, then electrical continuity is provided, but changes to the land pattern are required which are difficult for high-density mounting
Solution Approach 1:
The solder resist layer acts as an intermediary that enables the use of crossed electrode arrangements for reliable electrical continuity while preventing the need for complex land pattern changes. The solder resist allows the interposer to provide electrical continuity through via-holes with crossed electrode arrangements without requiring the circuit board land pattern to be modified.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces vibration transmission from the capacitor to the circuit board, prevents solder adhesion and burr formation, and facilitates easy mounting with improved structural design, maintaining electrical and mechanical integrity.
Implementation Method 1
the solder applied when bonding the interposer to the circuit board climbs and wets onto the multilayer ceramic capacitor
Data Source
AI summary
A multilayer ceramic capacitor includes flat inner electrodes that are laminated on each other. An interposer includes a substrate that is larger than the multilayer ceramic capacitor. A first mounting electrode to mount the multilayer ceramic capacitor is located on a first principal surface of the substrate, and a first external connection electrode for connection to an external circuit board is located on a second principal surface. A recess is located in a side surface of the interposer. A connecting conductor is located in the wall surface of the recess. The connecting conductor is located at a position spaced apart by a predetermined distance from the side surface of the interposer.