Interposer Posture Stabilization in Multilayer Ceramic Capacitors

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The posture of an interposer relative to a multilayer ceramic capacitor becomes unstable when solder is melted, leading to variations in the capacitor's posture after solidification, which affects the reliability and performance of the capacitor.

Innovation Solution

The design includes an interposer with specific through conductive portions and joining electrodes that provide electrical conduction and stabilize the posture by using solder for joining, ensuring that the conductive material flows and adheres correctly to maintain alignment and stability during the solidification process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If solder is used to join the interposer to the capacitor main body, then electrical connectivity and mechanical bonding are achieved, but the posture of the interposer becomes unstable when solder is melted

Engineering Contradiction:
Improveelectrical connectivityVSAvoidposture stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The joining electrodes are designed with extended portions that protrude from the interposer end surfaces before soldering. These extended portions make initial contact with the capacitor main body, establishing positional references and preventing posture variation even when solder melts during the joining process.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The joining electrodes act as intermediary elements between the interposer and the capacitor main body. Their extended portions serve as a stable interface that maintains posture stability while the solder provides electrical connectivity, separating the functions of mechanical positioning and electrical bonding.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Strength

If the interposer is joined to the capacitor main body using conventional soldering, then mechanical bonding is achieved, but variation arises in the posture of the capacitor main body after solidification

Engineering Contradiction:
Improvemechanical bondingVSAvoidposture alignment
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The extended portions of the joining electrodes are formed in advance to protrude from the interposer end surfaces. These protrusions establish precise positional relationships before the soldering process, ensuring that the capacitor main body maintains correct posture alignment after solidification.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The joining electrodes are designed with specific geometric parameters - extended portions that protrude by a controlled distance from the interposer end surfaces. This parameter change transforms the joining structure from a simple flat contact to a three-point contact system that maintains positional stability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively stabilizes the posture of the interposer relative to the capacitor main body, reducing equivalent series inductance (ESL) and enhancing the reliability and performance of the multilayer ceramic capacitor by ensuring proper alignment and electrical connectivity.

Implementation Method 1

a first through conductive portion that penetrates the interposer in the stacking direction, and provides electrical conduction between the first joining electrode and the first mounting electrode

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

the capacitor main body and the interposer are joined with solder

Methodology Applied
Scientific EffectSoldering: Soldering

Implementation Method 3

when solder is melted

Methodology Applied
Scientific EffectMelting: Melting

Data Source

PatentUS11404208B2Multilayer ceramic capacitor
Publication Date: 2022.08.02 MURATA MFG CO LTD
  • US11404208B2 patent drawing
  • US11404208B2 patent drawing
  • US11404208B2 patent drawing

AI summary

In a multilayer ceramic capacitor, an interposer includes, on a side of a first external electrode in a length direction, a first through conductive portion that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The interposer includes, on a side of a second external electrode in the length direction, a second through conductive portion that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The first joining electrode includes a first portion that covers a portion of a first interposer end surface on the one side in the length direction of the interposer. The second joining electrode includes a second portion that covers a portion of a second interposer end surface on the other side in the length direction of the interposer.