Multilayer Ceramic Capacitor Interposer With Recessed Through-Hole Solder Filling
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Solution Overview
Problem
Conventional multilayer ceramic capacitors face challenges in achieving a stable mounting position due to the filling of through-holes with joining solder, which prevents the mounting solder from entering, leading to unstable positioning and reduced joining strength.
Innovation Solution
The design incorporates pass-through conductive portions within the through-holes of the interposer, allowing for the formation of a space that enables the joining solder to flow and secure the capacitor's position without completely filling the holes, thereby ensuring stable mounting and enhanced joining strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the through-hole is filled with joining solder, then the joining strength between capacitor body and interposer is improved, but the mounting solder cannot enter the through-hole leading to unstable mounting position
Solution Approach 1:
The inside wall of the through-hole is covered with a pass-through conductive portion only in specific regions, creating local differences in surface properties. This allows the joining solder to be attracted to and bond with the conductive portion while leaving space for mounting solder to enter, thus achieving both strong joining and stable mounting positioning simultaneously
2Reliability
If a solder-free film is used to cover the through-hole, then the mounting position stability is improved, but the joining strength is reduced and an additional manufacturing step is required
Solution Approach 1:
The pass-through conductive portion is formed by combining the joining electrode and mounting electrode into a single integrated structure on the inside wall of the through-hole. This merged structure eliminates the need for separate solder-free film coverage while providing both joining and mounting functions, thereby maintaining joining strength and mounting stability without adding manufacturing steps
3Strength
If the through-hole is completely filled with joining solder, then the joining strength is maximized, but the equivalent series inductance increases affecting high-frequency performance
Solution Approach 1:
The pass-through conductive portion is provided only on the inside wall of the through-hole rather than filling the entire volume. This partial application provides sufficient joining strength through the conductive wall surface while leaving the central region open for mounting solder entry, thereby achieving adequate joining without the excessive inductance that would result from complete filling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for a stable and secure mounting of multilayer ceramic capacitors by allowing the mounting solder to enter the through-holes, improving the positioning and joining strength while reducing equivalent series inductance (ESL) for high-frequency signals.
Implementation Method 1
a first pass-through conductive portion provided on an inside wall of the first through-hole, the first pass-through conductive portion making the first joining electrode and the first mounting electrode conductive
Implementation Method 2
A first surface side of the first through-hole is filled with a first conductive joining material
Data Source
AI summary
An interposer of a multilayer ceramic capacitor includes a first through-hole in which a first pass-through conductive portion is provided on an inside wall thereof. A first surface side of the first through-hole is filled with a first conductive joining material that recessed at a central portion thereof as the first through-hole is seen from a second surface toward a first surface. The interposer includes a second through-hole in which a second pass-through conductive portion is provided on an inside wall thereof. A first surface side of the second through-hole is filled with a second conductive joining material that is recessed at a central portion thereof as the second through-hole is seen from a second surface toward a first surface.