Multilayer Ceramic Capacitor Interposer for Stable Solder Mounting
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Solution Overview
Problem
Multilayer ceramic capacitors experience instability in posture during soldering, leading to variations in their mounted position on substrates due to the melting of solder.
Innovation Solution
The use of an interposer with specific electrode configurations and through conductive portions that provide electrical conduction between external electrodes and mounting electrodes, allowing for stable mounting by optimizing the flow and positioning of solder during the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is melted to mount the multilayer ceramic capacitor on the substrate, then the capacitor can be securely attached to the substrate, but the posture of the capacitor becomes unstable during the soldering process, leading to variation in the mounted position
Solution Approach 1:
The patent introduces an interposer as an intermediary component between the multilayer ceramic capacitor and the substrate. The interposer includes mounting electrodes that extend to the side surfaces of the capacitor, providing additional attachment points. This intermediary structure stabilizes the capacitor posture during soldering by distributing the mounting forces across multiple contact points, thereby preventing position variation while maintaining secure attachment.
2Device complexity
If the capacitor is mounted directly on the substrate using conventional methods, then the structure remains simple, but the posture stability during mounting deteriorates
Solution Approach 1:
The patent segments the mounting function by separating it into two distinct components: the interposer and the substrate. The interposer specifically handles the side-surface mounting electrodes that contact the capacitor, while the substrate provides the primary mounting surface. This segmentation allows the interposer to specialize in stabilizing the capacitor posture during mounting, achieving improved stability without significantly increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the stabilization of the multilayer ceramic capacitor's posture during mounting, reducing equivalent series inductance (ESL) and ensuring reliable electrical connections while preventing the intrusion of moisture and enhancing the insulating properties.
Implementation Method 1
a first through conductive portion that penetrates the interposer in the stacking direction, and provides electrical conduction between the first joining electrode and the first mounting electrode
Implementation Method 2
when solder is melted, the posture of a multilayer ceramic capacitor becomes unstable on the substrate, and thus, variation tends to arise in the posture of the multilayer ceramic capacitor after the solder has solidified
Data Source
AI summary
A multilayer ceramic capacitor includes an interposer including, on a side in a length direction, a first through conductive portion that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The interposer includes, on the other side in the length direction, a second through conductive portion that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The first mounting electrode includes a first portion that covers a portion of a first interposer end surface on the one side in the length direction of the interposer. The second mounting electrode includes a second portion that covers a portion of a second interposer end surface on the other side in the length direction of the interposer.