Multilayer Ceramic Capacitor Interposer With Uncovered Through Hole Portions
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Solution Overview
Problem
Existing multilayer ceramic capacitors face challenges in stabilizing posture during mounting due to solder flow issues in through holes, requiring additional steps like covering with a solder-non-adhering film to prevent solder filling, which complicates the mounting process.
Innovation Solution
The design incorporates an interposer with through holes having metal films on the inner walls, featuring uncovered portions that allow for easier gap creation, enabling stable mounting without filling the through holes with solder, thus stabilizing the posture during assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the through hole is filled with solder, then electrical conduction between external electrodes and substrate is improved, but the posture stability during mounting deteriorates
Solution Approach 1:
The patent applies local quality by creating a non-uniform structure within the through hole: the lower portion is filled with solder to ensure electrical conduction, while the upper portion remains empty to maintain posture stability. This is achieved through the protrusion structure that extends into the through hole, which prevents solder from filling the entire hole while ensuring adequate electrical connection at the bottom.
2Stability of the object's composition
If a solder-non-adhering film is used to prevent solder filling, then posture stability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent extracts the solder-non-adhering function from a separate film layer and integrates it directly into the interposer structure through the protrusion. The protrusion itself creates the gap that prevents solder filling, eliminating the need for an additional solder-non-adhering film and its associated manufacturing steps.
Solution Approach 2:
The patent merges multiple functions into the protrusion structure: it serves as both a mechanical element defining the gap for posture stability and an electrical connection element ensuring solder contact with the mounting electrode. This integration eliminates the need for separate solder-non-adhering films and reduces manufacturing complexity.
3Stability of the object's composition
If the through hole is left empty to maintain posture stability, then mounting stability is improved, but electrical conduction reliability deteriorates
Solution Approach 1:
The patent segments the through hole into two functional zones: the lower portion filled with solder for electrical conduction, and the upper portion left empty for posture stability. The protrusion structure defines this segmentation, allowing both requirements to be satisfied simultaneously in different spatial regions of the same through hole.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for stable posture stabilization during mounting by providing gaps in the through holes without the need for additional film coverage, ensuring proper alignment and strong joining between the capacitor and interposer while maintaining electrical conductivity.
Implementation Method 1
a first through hole that penetrates the interposer in the stacking direction, and provides electrical conduction between the first joining electrode and the first mounting electrode
Data Source
AI summary
In a multilayer ceramic capacitor, an interposer includes, on a side of a first external electrode in a length direction, a first through hole that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The first through hole further includes a first metal film provided on an inner wall thereof. The interposer includes, on a side of a second external electrode in the length direction, a second through hole that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The second through hole further includes a second metal film provided on an inner wall thereof. A first uncovered portion is provided, which is not covered by the first metal film, on a first surface of the inner wall of the first through hole, and a second uncovered portion is provided which is not covered by a second metal film on the first surface of the inner wall of the second through hole.