Multilayer Ceramic Capacitor Interposer Vias Suppress Electrostriction Noise
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Solution Overview
Problem
Conventional multilayer ceramic capacitors with interposers experience noise due to electrostriction, particularly when mounted on substrates, as electrostriction causes warping and vibration, exacerbated by the formation of fillets during soldering, which transmit tensile forces to the substrate.
Innovation Solution
The design incorporates an interposer with conductor vias that have through holes with voids, reducing solder overflow and preventing fillet formation, thereby minimizing substrate warping and noise. The interposer connects the capacitor's external electrodes to the substrate via solder, ensuring secure electrical connection while mitigating stress from electrostriction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional soldering is used to join the capacitor to the substrate, then strong electrical connection is achieved, but fillet formation transmits tensile forces to the substrate causing warping and noise
Solution Approach 1:
The patent extracts the harmful fillet formation from the soldering process by using conductor vias with through holes that prevent solder from overflowing and forming fillets. The solder is confined within the via holes, eliminating the source of tensile forces that cause substrate warping and noise while maintaining electrical connection strength.
Solution Approach 2:
The conductor vias act as intermediaries between the capacitor and substrate. These vias with controlled through holes mediate the soldering process by providing a defined path for solder flow that prevents harmful fillet formation while still achieving strong electrical and mechanical connection.
2Reliability
If the capacitor is mounted on a substrate, then electrical connection is established, but electrostriction causes warping and vibration during operation
Solution Approach 1:
The patent applies beforehand cushioning by designing conductor vias with through holes that prevent solder fillet formation in advance. This structural design cushions against the tensile forces generated during electrostriction, preventing substrate warping and vibration before they occur during capacitor operation.
3Strength
If solder is applied generously to ensure strong joining, then connection strength is improved, but excessive solder creates fillets that increase tensile forces on the substrate
Solution Approach 1:
The patent applies local quality by confining solder to specific locations within the conductor via through holes. This localized solder placement ensures strong joining at the critical connection points while preventing solder from forming harmful fillets that would generate excessive tensile forces on the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses noise generated by electrostriction by reducing substrate warping and maintaining strong electrical connections, enhancing the joining strength of the capacitor to the substrate.
Implementation Method 1
the cream solder is melted by the reflow soldering method or other heat treatment and then cured, to join each second conductor pad 203 to each conductor pad 302 on the substrate 300 via solder SOL
Implementation Method 2
electrostriction occurs in the dielectric chip 101 due to application of voltage, especially application of alternating-current voltage, to the capacitor 100 in the mounted condition
Data Source
AI summary
An embodiment of an multilayer ceramic capacitor with interposer includes: an interposer 20 having an insulated substrate 21, two first conductor pads 22, two second conductor pads 23 and two conductor vias 24 connecting the first conductor pads 22 and second conductor pads 23; and a multilayer ceramic capacitor 10 having external electrodes 12 that are each connected to each first conductor pad 22 of the interposer 20 via solder SOL. Each conductor via 24 of the interposer 20 has a through hole 24a inside, and a void GA not filled with the solder SOL is present in each through hole 24a on the second conductor pad 23 side. The multilayer ceramic capacitor with interposer is capable of suppressing noise due to electrostriction.