Multilayer Ceramic Capacitor Interposer Vibration Noise Reduction
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Solution Overview
Problem
Multilayer ceramic capacitors in mobile devices experience mechanical distortion due to voltage variations, causing vibration in circuit boards and audible noise, which is difficult to mitigate with existing interposer designs that compromise miniaturization, mounting strength, and high-density mounting capabilities.
Innovation Solution
A multilayer ceramic capacitor mounted on a flat-shaped insulating substrate with recesses and connecting conductors that direct the bonding agent to minimize adhesion on distorted regions, ensuring strong and efficient electrical connections while reducing vibration noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the multilayer ceramic capacitor is mounted directly on the circuit board, then the mounting structure is simple and the electrical connection is direct, but vibration sound occurs due to mechanical distortion from voltage variations
Solution Approach 1:
An interposer substrate is introduced as an intermediary component between the multilayer ceramic capacitor and the circuit board. This interposer absorbs mechanical distortion from voltage variations, preventing vibration sound while maintaining electrical connection through via-holes that penetrate the interposer to connect upper and lower electrodes.
2Object-affected harmful factors
If an interposer is used to prevent vibration sound, then vibration noise is reduced, but the height of the mounting structure increases and miniaturization becomes difficult
Solution Approach 1:
The interposer substrate is designed with a thin profile that nests closely between the multilayer ceramic capacitor and the circuit board. The via-holes are integrated within the interposer thickness, allowing the entire assembly to maintain a compact height while still providing distortion absorption functionality.
3Object-affected harmful factors
If the interposer uses a crossed arrangement of electrodes to reduce vibration, then vibration sound is reduced, but changes to the land pattern are required which increases complexity for high-density mounting
Solution Approach 1:
The interposer substrate serves multiple functions simultaneously: it provides mechanical support, absorbs distortion, establishes electrical connections through via-holes, and maintains compatibility with standard land patterns. This multi-functionality eliminates the need for specialized crossed electrode arrangements while still preventing vibration sound.
4Object-affected harmful factors
If the multilayer ceramic capacitor is supported in midair by a conductive support member, then mounting strength is reduced and height increases, but vibration sound may be reduced
Solution Approach 1:
The interposer substrate acts as a mediator that provides both mechanical support and distortion absorption. Unlike midair support that leaves the capacitor vulnerable, the interposer firmly bonds the capacitor to the circuit board while its compliant structure absorbs vibration, simultaneously improving mounting strength and reducing sound.
Data Source
AI summary
A multilayer ceramic capacitor includes flat-shaped inner electrodes that are laminated. An interposer includes an insulating substrate that is larger than contours of the multilayer ceramic capacitor. A first mounting electrode that mounts the multilayer ceramic capacitor is located on a first principal surface of the insulating substrate, and a first external connection electrode for connection to an external circuit board located on a second principal surface. The multilayer ceramic capacitor is mounted onto the interposer in such a way that the principal surfaces of the inner electrodes are parallel or substantially parallel to the principal surface of the interposer, that is, the first and second principal surfaces of the insulating substrate.