Multilayer Ceramic Chip Laser Cutting for Crack-Free Cross-Sections

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Solution Overview

Problem

Existing methods for cutting ceramic laminates in multilayer ceramic capacitors face issues such as deformation, cracks, and chip sticking due to direct contact with blades, and inefficient processing with lasers that cause trapezoidal cross-sections and unreliable electrode formation.

Innovation Solution

Cutting the ceramic laminate using lasers on both surfaces non-contactually, adjusting the cutting path to account for deformation, and setting the cutting area based on image differentiation to prevent defects and improve shape control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a blade is used to cut the ceramic laminate, then the cutting process is simple and direct, but cracks occur due to shear stress and chip sticking defects occur

Engineering Contradiction:

Improvecutting process simplicityVSAvoidabsence of cracks and chip sticking defects

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent replaces the mechanical blade cutting system with a laser-based cutting system. The laser beam cuts the ceramic laminate without physical contact, eliminating shear stress that causes cracks and preventing chip sticking defects. This substitution of mechanical cutting with optical/thermal cutting resolves the contradiction between manufacturing simplicity and product reliability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If a laser is used to cut the ceramic laminate, then cracks and chip sticking are prevented, but processing speed decreases and cross-section becomes trapezoidal

Engineering Contradiction:

Improveabsence of cracks and chip sticking defectsVSAvoidprocessing speed

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent divides the laser cutting process into two separate operations: one laser beam cuts from the first surface while another laser beam cuts from the second surface simultaneously. This segmentation of the cutting process allows both surfaces to be processed in parallel, significantly increasing processing speed while maintaining the reliability benefits of laser cutting and producing a rectangular cross-section.

Inventive Principle:

Principle #1Segmentation

3Manufacturing precision

If laser processing depth increases, then complete cutting is achieved, but processing speed decreases

Engineering Contradiction:

Improvecutting completenessVSAvoidprocessing speed

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent transitions from single-direction (one-surface) laser cutting to dual-direction (both-surface) laser cutting. By introducing the second surface as an additional dimension for simultaneous processing, the total cutting depth requirement is divided between two beams, each traveling a shorter distance, thereby maintaining complete cutting while doubling the processing speed.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Manufacturing precision

If the laser moves away from the focal point to increase processing depth, then complete cutting is achieved, but the processing line width increases causing diagonal cuts

Engineering Contradiction:

Improvecutting completenessVSAvoidcross-section geometry

Core Design Contradiction:

Manufacturing precisionVSShape

Solution Approach 1:

The patent segments the cutting task between two laser beams operating from opposite surfaces. Each beam focuses at or near its respective surface, maintaining a consistent focal point and narrow processing line width. This segmentation prevents the line width expansion that occurs when a single beam moves away from its focal point, ensuring rectangular cross-section geometry while achieving complete cutting.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents cracks and chip sticking, enhances processing efficiency, and improves the reliability of multilayer ceramic capacitors by ensuring uniform electrode formation and controlled cross-sections.

Implementation Method 1

cutting the ceramic laminate into individual multilayer chips, by irradiating a laser onto one surface of the ceramic laminate and irradiating a laser onto the other surface opposing the one surface of the ceramic laminate in the first direction

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS20260018344A1Method of manufacturing multilayer electronic component, and multilayer electronic component

Publication Date: 2026.01.15 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A method of manufacturing a multilayer electronic component includes forming a ceramic laminate in which a plurality of ceramic green sheets and a plurality of internal electrode patterns are stacked in a first direction; cutting the ceramic laminate into individual multilayer chips, by irradiating a laser onto one surface of the ceramic laminate and irradiating a laser onto the other surface opposing the one surface of the ceramic laminate in the first direction; firing one of the multilayer chips so as to form a ceramic body including an internal electrode and a dielectric layer; and forming external electrodes on a first side and a second side of the ceramic body.