Multi-Layer Ceramic Capacitor Lead Module with Integral Crimps
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Solution Overview
Problem
Current solutions for mounting stacked multi-layered ceramic capacitors (MLCCs) remotely from a circuit board fail to maintain mechanical integrity, joint integrity, and strain relief while ensuring adequate electrical properties and accommodating thermal expansion/contraction.
Innovation Solution
A lead module with integral crimps and expansion links that allows for remote mounting of MLCCs, using a lead frame with electrical and mechanical crimps to attach the capacitors, and an interposer to reduce thermal expansion coefficients, enabling flexible attachment and strain relief.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If stacked MLCC capacitors are mounted remotely from the circuit board using soft leads, then the capacitor can be attached to an independent structure, but mechanical lead integrity and joint integrity deteriorate due to lead strain and thermal expansion
Solution Approach 1:
The lead assembly is segmented into multiple functional zones: the rigid lead frame portion provides structural support and electrical connection, while the separate soft lead portion provides flexibility and strain relief. This segmentation allows each part to perform its specialized function, maintaining both remote mounting capability and lead integrity.
Solution Approach 2:
The lead assembly combines rigid metal (lead frame) with flexible metal (soft lead) to create a composite structure. The rigid portion maintains mechanical integrity and electrical properties, while the flexible portion accommodates thermal expansion and strain, resolving the contradiction between remote mounting and reliability.
2Adaptability or versatility
If soft leads are used for remote mounting, then the capacitor can be flexibly attached, but electrical properties deteriorate due to lead strain and thermal variations
Solution Approach 1:
The lead structure is divided into rigid and flexible segments, where the rigid lead frame maintains stable electrical properties by minimizing strain on the capacitor terminations, while the flexible soft lead portion handles mechanical movement and thermal expansion separately.
Solution Approach 2:
The soft lead acts as an intermediary element between the rigid lead frame and the capacitor termination. It absorbs thermal expansion and mechanical strain, preventing these forces from transmitting to the electrical joint and degrading electrical properties.
3Device complexity
If leads are attached directly to MLCC terminations, then the structure is simplified, but strain relief between capacitors in a common module cannot be provided
Solution Approach 1:
The lead assembly is segmented into a rigid support structure and flexible strain relief portions. This segmentation allows the structure to remain relatively simple while incorporating dedicated zones for strain relief, enabling multiple capacitors to be mounted in a common module without mutual interference.
Solution Approach 2:
The soft lead portion functions as a flexible element that can bend and deform to accommodate thermal expansion and mechanical strain. This flexibility provides strain relief capability while maintaining a relatively simple overall structure compared to rigid support systems.
4Strength
If rigid mounting structures are used, then mechanical integrity is improved, but thermal expansion and contraction cannot be accommodated
Solution Approach 1:
The lead assembly explicitly incorporates thermal expansion considerations by using a bimetallic or composite construction where different materials expand at different rates. The soft lead portion is designed to flex and accommodate thermal expansion, while the rigid lead frame maintains mechanical integrity.
Solution Approach 2:
The combination of rigid and flexible materials in the lead assembly creates a composite structure that simultaneously provides mechanical strength and thermal adaptability. The rigid portion resists deformation while the flexible portion accommodates thermal expansion, resolving the contradiction between strength and adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides robust mechanical and electrical performance by allowing thermal expansion and contraction, maintaining electrical properties, and ensuring strain relief between capacitors, thus addressing the limitations of existing technologies.
Implementation Method 1
an expansion link 16 formed as an integral portion of the lead frame 10 between the leads 12... allowing for thermal expansion or contraction
Implementation Method 2
Each lead 12 comprises an integral crimp 14... wherein the attached wire 20 is soldered to the attached crimp terminal 22
Data Source
AI summary
An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp.