Multilayer Ceramic Capacitor Margin Sintering Control

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Solution Overview

Problem

Multilayer ceramic capacitors face issues with poor connection between internal and external electrodes due to differences in sintering behavior between ceramic margin parts and metal electrodes, leading to structural defects and insulation failures.

Innovation Solution

Incorporating boron into end margin parts to align their sintering behavior with metal electrodes and using silicon in side margin parts to control sinterability and prevent oversintering, thereby maintaining electrode connection and insulation integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If side margin parts have high exposure to firing atmosphere to allow stress relaxation, then sintering behavior approaches metal sintering behavior, but oversintering occurs and insulating property deteriorates

Engineering Contradiction:
Improvestress relaxation with functional partVSAvoidinsulating property
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The patent applies different sintering aid compositions to different regions: end margin parts contain sintering aids (MgO, MnO, SiO2, B2O3) to match the sintering behavior of metal electrodes and ensure good connection, while side margin parts contain minimal sintering aids to prevent oversintering and maintain insulating properties. This spatial differentiation of material composition resolves the contradiction between connection reliability and insulating property.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the concentration parameters of sintering aids in different margin parts. End margin parts have higher concentrations of sintering aids (MgO: 0.1-5 wt%, MnO: 0.1-5 wt%, SiO2: 0.1-5 wt%, B2O3: 0.1-5 wt%) to promote sintering and match metal electrode behavior, while side margin parts have lower concentrations (MgO: 0.01-0.1 wt%, MnO: 0.01-0.1 wt%, SiO2: 0.01-0.1 wt%, B2O3: 0.01-0.1 wt%) to suppress oversintering and maintain insulation. This parameter differentiation resolves the contradiction.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The approach effectively suppresses poor connections and insulation failures by ensuring consistent sintering behavior between ceramic and metal components, reducing structural defects and maintaining reliable electrical properties.

Implementation Method 1

the margin parts have a higher sintering temperature than metal, and the progress of sintering is slow. Therefore, during firing, stress due to the difference in sintering behavior is applied between the functional part having the internal electrodes and the margin parts

Methodology Applied
Scientific EffectSintering: Sintering

Implementation Method 2

for the side margin parts, although it is desired to approach the sintering behavior of the metal from the viewpoint of stress relaxation with the functional part, the side margin parts have a high degree of exposure to the firing atmosphere and are easily oversintered

Methodology Applied
Scientific EffectSintering: Sintering

Data Source

PatentUS11437195B2Multilayer ceramic electronic component and manufacturing method therefor
Publication Date: 2022.09.06 TAIYO YUDEN KK
  • US11437195B2 patent drawing
  • US11437195B2 patent drawing
  • US11437195B2 patent drawing

AI summary

A multilayer ceramic electronic component includes a ceramic main body including a functional part in which first internal electrodes and second internal electrodes are laminated in a vertical direction, end margin parts provided respectively between a first end surface of the ceramic main body and the second internal electrodes and between a second end surface of the ceramic main body and the first internal electrodes, and side margin parts that respectively cover the functional part from sides. The electronic component further includes external electrodes respectively provided on the first end surface and the second end surface. The end margin parts contain boron (B), and the side margin parts contain silicon (Si) and boron. A concentration of boron in the side margin parts is less than a concentration of boron in the end margin parts.