MLCC Margin Dielectric Structure for Electrode Adhesion Stability
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Solution Overview
Problem
The multilayer ceramic capacitor (MLCC) experiences issues with insufficient adhesion between internal and external electrodes due to uneven pressure distribution and thermal expansion differences between capacitance forming and margin portions, leading to step portions and electrode bending during compression and sintering.
Innovation Solution
Incorporating a second dielectric layer made of Ta4AlC3 in the margin portions to equalize pressure and thermal expansion, ensuring consistent adhesion and minimizing step differences, thereby improving electrode connectivity and resistance to external impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If compression process is performed on the multilayer body, then the internal electrodes are connected to external electrodes, but step portions occur due to difference in thermal expansion coefficients between capacitance forming portion and margin portion
Solution Approach 1:
The patent applies a specific dielectric material (Ta4AlC3) only in the margin portion of the multilayer body, where it is needed to counteract thermal expansion differences. This localized application allows the capacitance forming portion to maintain its original properties while the margin portion compensates for thermal stress, preventing step portions without affecting overall device function.
Solution Approach 2:
The patent uses a composite structure combining different dielectric materials - the first dielectric material in the capacitance forming portion and the second dielectric material (Ta4AlC3) in the margin portion. This composite approach leverages the different thermal expansion coefficients of the two materials to balance overall thermal stress and prevent deformation during compression and sintering.
2Manufacturing precision
If sintering process is performed, then the multilayer body is formed, but step portions occur due to uneven thermal expansion and contraction
Solution Approach 1:
The patent introduces a functionally differentiated region in the margin portion with specific dielectric material (Ta4AlC3) that has different thermal expansion characteristics. This local modification allows the margin portion to compensate for thermal stress during sintering, maintaining uniform body shape without affecting the capacitance forming portion's electrical properties.
Solution Approach 2:
The patent changes the thermal expansion parameter by introducing a second dielectric material with different thermal expansion coefficient in the margin portion. This parameter modification balances the thermal stress distribution during sintering, preventing step portions and maintaining manufacturing precision.
3Reliability
If internal electrodes extend in opposite directions to connect to external electrodes, then electrical connection is achieved, but adhesion is insufficient due to different lamination degrees in capacitance forming portion and margin portion
Solution Approach 1:
The patent addresses the adhesion problem by applying a specific dielectric material (Ta4AlC3) in the margin portion where internal electrodes need to connect to external electrodes. This localized treatment ensures proper adhesion in the connection region without affecting the capacitance forming portion, simplifying the overall structure while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances electrode adhesion and reduces bending, improving the reliability and moisture resistance of the MLCC by stabilizing the thermal expansion and contraction of the margin portions, thus maintaining electrical connectivity and structural integrity.
Implementation Method 1
a step portion may occur due to a difference in thermal expansion and contraction due to a difference in thermal expansion coefficients between the capacitance forming portion and the margin portion
Implementation Method 2
Incorporating a second dielectric layer made of Ta4AlC3 in the margin portions of the multilayer electronic component, which helps to cancel out pressure differences
Data Source
AI summary
A multilayer electronic component includes a body including a first dielectric layer and internal electrodes alternately disposed with the first dielectric layer interposed therebetween in a first direction; and external electrodes disposed on the body. The internal electrodes include body portions alternately disposed with the first dielectric layer in the first direction to form capacitance, and end portions extending from the body portions in the second direction. A region including the first dielectric layer and the body portions in the body is a capacitance forming portion. Regions disposed on one surface and the other surface of the capacitance forming portion in the second direction and including the end portions of the internal electrodes is first margin portions. The first margin portions are disposed between the end portions of the internal electrodes and include a second dielectric layer including Ta4AlC3.