Multilayer Ceramic Capacitor Electrode Bonding With Metal-Filled Microcracks
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Solution Overview
Problem
Existing multilayer ceramic capacitors face challenges in reducing the volume of external electrodes and ensuring strong bonding between the plating layer and the ceramic main body, with issues such as peeling and poor plating due to seed layer detachment during the plating process.
Innovation Solution
The multilayer ceramic capacitor incorporates a ceramic main body with a microcrack-filled plating layer on a surface featuring an amorphous structure, including irregularities with valleys and ridges, and laser-irradiated regions to enhance bonding and reduce electrode thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal thin film is formed on the ceramic main body surface to serve as a seed layer for plating, then plating can be achieved, but the seed layer may peel off or fall off during the plating process resulting in poor plating quality
Solution Approach 1:
The patent applies preliminary action by forming micro protrusions on the ceramic main body surface before plating, and pre-filling these protrusions with metal material to create a robust seed layer foundation. This preliminary structuring ensures that the plating layer has strong anchoring points from the beginning, preventing peeling during the plating process.
Solution Approach 2:
The patent utilizes porous-like micro protrusion structures on the ceramic surface that are filled with metal material. These micro-cavity structures provide increased surface area and mechanical interlocking, allowing the plating layer to bond more strongly to the ceramic substrate, thereby preventing peeling and improving overall plating quality.
2Quantity of substance
If the external electrode volume is reduced to increase capacitance, then the capacitor capacity improves, but the plating layer may detach from the ceramic main body
Solution Approach 1:
The patent applies local quality by creating micro protrusions at specific locations on the ceramic main body surface and selectively filling these protrusions with metal material. This localized enhancement of bonding structure allows the plating layer to maintain strong adhesion even when the overall external electrode volume is reduced, thus improving capacitance without sacrificing bonding strength.
Solution Approach 2:
The patent uses composite materials by combining ceramic main body with metal-filled micro protrusions. This composite structure integrates the electrical properties of metal with the mechanical stability of ceramic, creating a hybrid interface that provides both strong adhesion for the plating layer and reduced overall electrode volume for increased capacitance.
3Strength
If the plating layer thickness is increased to improve bonding, then adhesion strength improves, but the external electrode volume increases reducing capacitance
Solution Approach 1:
The patent utilizes the metal-filled micro protrusion structures as anchoring points that provide strong mechanical interlocking. This allows the plating layer to achieve sufficient adhesion strength with reduced thickness, as the bonding strength is concentrated at the micro protrusion interfaces rather than distributed uniformly, thereby maintaining strong adhesion while reducing overall electrode volume for improved capacitance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design results in a thinner external electrode, improving capacitance and adhesion strength while minimizing the risk of plating layer detachment, thereby enhancing the performance and reliability of the capacitor.
Implementation Method 1
the surface of the ceramic main body, which is in contact with the plating layer, includes an amorphous structure
Implementation Method 2
a surface of the ceramic main body that is in contact with the plating layer includes a laser irradiation region having a certain depth
Implementation Method 3
the micro crack may be filled with a metal that comprises the plating layer
Data Source
AI summary
The disclosed multilayer ceramic capacitor may include: a ceramic main body; an internal electrode disposed inside the ceramic main body; and an external electrode including a plating layer that contacts a surface of the ceramic main body and is connected to the internal electrode, in which a micro crack exists inward from a surface of the ceramic main body where the plating layer is in contact, and the micro crack may be filled with a metal that comprises the plating layer, and the surface of the ceramic main body, which is in contact with the plating layer, may include an amorphous structure.