Multilayer Ceramic Capacitor Metal Frame Vibration Isolation
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Solution Overview
Problem
Multilayer ceramic capacitors generate acoustic noise due to vibrational sounds within the audio frequency range, causing discomfort, as the piezoelectric phenomenon induces periodic vibrations that are transferred to the board through external electrodes and solders.
Innovation Solution
The implementation of first and second metal frames on the ceramic body, positioned inwardly of both end surfaces in the length direction, spaced apart from the end surfaces, which secure a predetermined interval between the capacitor and the circuit board, preventing direct contact and reducing vibrations that cause acoustic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the multilayer ceramic capacitor is directly mounted on the circuit board without metal frames, then the device complexity is reduced and ease of manufacture is improved, but acoustic noise is generated due to vibration transfer through external electrodes and solders
Solution Approach 1:
Metal frames are introduced as intermediary elements between the external electrodes and the circuit board. These frames serve as vibration isolation structures that prevent direct contact and vibration transfer, thereby reducing acoustic noise while maintaining electrical connection functionality through the soldering process
Solution Approach 2:
The mounting structure is segmented by introducing metal frames that are positioned inwardly from the end surfaces of the ceramic body. This segmentation creates a physical barrier that isolates the vibration source (external electrodes) from the transmission path (circuit board), effectively reducing noise without requiring complete structural redesign
2Object-affected harmful factors
If metal frames are positioned close to the end surfaces of the ceramic body, then the structural support is improved and ease of manufacture is enhanced, but the vibrations are still transferred to the circuit board causing acoustic noise
Solution Approach 1:
The position parameter of the metal frames is optimized by specifying that they be located inwardly from the end surfaces of the ceramic body by predetermined intervals. This parameter change ensures effective vibration isolation while maintaining manufacturability, as the inward positioning provides sufficient space for soldering operations and frame attachment without requiring extremely precise positioning
3Object-affected harmful factors
If the external electrodes are directly connected to the circuit board through solders, then the electrical connection is improved and device complexity is reduced, but the vibrations are transferred to the board generating acoustic noise
Solution Approach 1:
Metal frames serve as intermediary structures that maintain electrical connection reliability while isolating vibrations. The frames are soldered to the circuit board and provide a mechanical support structure that separates the vibration-prone external electrodes from the board, ensuring both electrical connectivity and vibration reduction
Solution Approach 2:
The metal frames provide localized vibration isolation at specific mounting points on the circuit board. By positioning the frames inwardly from the end surfaces, the solution creates localized damping zones that prevent vibration transfer to the board while maintaining electrical connection reliability through the soldered frame structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metal frames effectively reduce acoustic noise by alleviating vibrations transferred to the circuit board, achieving noise levels below 30 dBA when the ratio of specific dimensions is within the specified range, thereby enhancing the usability of multilayer ceramic capacitors in electronic devices.
Implementation Method 1
since the dielectric layer has piezoelectric characteristics, when a direct current (DC) voltage or an alternating current (AC) voltage is applied to such a multilayer ceramic capacitor, a piezoelectric phenomenon may be generated between the internal electrodes, thereby generating periodic vibrations, while expanding and contracting a volume of a ceramic body according to the frequency of the voltage applied thereto
Implementation Method 2
the first and second metal frames are positioned inwardly of both end surfaces of the ceramic body in a length direction of the ceramic body to be spaced apart from both end surfaces of the ceramic body in the length direction of the ceramic body, respectively
Data Source
AI summary
A multilayer ceramic capacitor (MLCC) includes: first and second metal frames formed on a mounting surface of a ceramic body to be connected to first and second external electrodes providing voltages having opposing polarities, respectively, wherein the first and second metal frames are positioned inwardly of both end surfaces of the ceramic body in a length direction of the ceramic body to be spaced apart from both end surfaces of the ceramic body, respectively.