Multilayer Ceramic Capacitor Interfacial Mn Segregation
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Solution Overview
Problem
The miniaturization and increased capacitance of multilayer ceramic capacitors are hindered by the thinning of internal electrodes, which can lead to disconnection, decreased insulation resistance, and reduced withstand voltage, compromising reliability.
Innovation Solution
Incorporating interfacial portions of internal electrodes with a higher Mn content at interfaces with dielectric layers, ensuring high interfacial resistance and improved withstand voltage characteristics, while maintaining thin dielectric and internal electrode thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of internal electrodes is reduced to achieve miniaturization and increased capacitance, then the number of stacked layers increases and capacitance improves, but the internal electrode may experience disconnection, decreased insulation resistance, and reduced withstand voltage
Solution Approach 1:
The patent applies local quality by creating an interfacial portion at the internal electrode with a different Mn content (0.01-3 wt%) than the central portion. This localized compositional change at the electrode-dielectric interface improves adhesion and prevents disconnection, while the thin overall electrode structure (0.3-1.0 μm) maintains miniaturization and high capacitance.
2Volume of moving object
If the thickness of internal electrodes is reduced, then miniaturization is achieved, but withstand voltage characteristics deteriorate
Solution Approach 1:
The patent creates a localized interfacial portion with modified Mn content (0.01-3 wt%) at the internal electrode-dielectric layer interface. This local compositional modification enhances the interface quality and withstand voltage characteristics, while the overall thin electrode structure (0.3-1.0 μm) achieves miniaturization.
Solution Approach 2:
The patent changes the chemical composition parameter (Mn content) specifically at the interfacial portion of the internal electrode. By adjusting the Mn content in the range of 0.01-3 wt% at the interface, the patent improves withstand voltage characteristics while maintaining the thin electrode structure for miniaturization.
3Quantity of substance
If the thickness of internal electrodes is reduced, then the number of stacked layers increases for higher capacitance, but insulation resistance decreases
Solution Approach 1:
The patent applies local quality by forming an interfacial portion with distinct Mn content (0.01-3 wt%) at the internal electrode-dielectric interface. This localized compositional modification improves insulation resistance at the critical interface region, preventing leakage paths while allowing the thin electrode structure to support higher stacked layers for increased capacitance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and withstand voltage of multilayer electronic components, facilitating miniaturization and increased capacitance without deteriorating performance.
Implementation Method 1
One of the internal electrodes includes interfacial portions disposed at interfaces thereof with two of the dielectric layers, between which the one of the internal electrodes is disposed, and a central portion disposed between the interfacial portions, and one of the interfacial portions has a Mn content higher than an average Mn content of the central portion and an average Mn content of one of the dielectric layers
Data Source
AI summary
A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers; and external electrodes disposed on the body. One of the internal electrodes includes interfacial portions disposed at interfaces thereof with two of the dielectric layers, between which the one of the internal electrodes is disposed, and a central portion disposed between the interfacial portions, and one of the interfacial portions has a Mn content higher than an average Mn content of the central portion and an average Mn content of one of the dielectric layers which is in contact with the one of the interfacial portions.