MLCC Mounting Structure Reducing Vibration Noise via Bonding Height
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multi-layered ceramic capacitors generate vibration noise due to piezoelectricity and electrostriction when mounted on circuit boards, leading to unwanted acoustic radiation, and existing solutions do not effectively reduce this noise without complex processes.
Innovation Solution
A mounting structure for multi-layered ceramic capacitors on circuit boards where the bonding height of the conductive material is adjusted to be lower than the sum of the gap between the board and the capacitor's cover layer thickness, ensuring internal electrodes are parallel to the board, reducing vibration transmission and noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the multi-layered ceramic capacitor is mounted on the circuit board with conventional bonding height, then the bonding force is sufficient, but the vibration noise is generated and transmitted to the board
Solution Approach 1:
The patent changes the bonding height parameter of the conductive material to resolve the contradiction between bonding force and vibration noise. By optimizing the bonding height to be within a specific range (0.5-2.0 mm), the patent achieves both sufficient bonding reliability and reduced vibration noise transmission to the circuit board.
2Object-generated harmful factors
If the bonding height of the conductive material is reduced to reduce vibration noise, then the noise transmission is minimized, but the bonding force may be insufficient
Solution Approach 1:
The patent applies parameter changes by establishing an optimal bonding height range (0.5-2.0 mm) that balances vibration noise reduction with bonding reliability. This specific parameter range ensures that the conductive material is short enough to minimize vibration transmission while long enough to maintain sufficient bonding strength.
3Object-generated harmful factors
If existing techniques are used to prevent vibration noise (elastic deformation, separate parts, board holes), then some noise reduction is achieved, but the process complexity increases and remarkable effect is not obtained
Solution Approach 1:
The patent merges the vibration noise reduction function into the bonding process itself by optimizing the bonding height of the conductive material. This eliminates the need for separate vibration prevention processes such as elastic deformation techniques, separate noise suppression parts, or board hole formation, thereby reducing process complexity while achieving remarkable noise reduction效果.
Solution Approach 2:
The patent extracts the vibration noise reduction function from separate complex processes and integrates it into the bonding height parameter of the conductive material. By taking out the noise reduction requirement from the overall manufacturing process and addressing it through a single parameter optimization, the patent simplifies the manufacturing process while achieving effective noise suppression.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces vibration noise to levels below 25 dB, enhancing the reliability of the bonding force while minimizing noise transmission, particularly when the capacitors are horizontally mounted.
Implementation Method 1
the external terminal electrodes are bonded to lands of the circuit board by a conductive material
Implementation Method 2
since the ferroelectric material has piezoelectricity and electrostriction, stress and mechanical deformation appear as vibration when an electric field is applied to the ferroelectric material
Implementation Method 3
since the ferroelectric material has piezoelectricity and electrostriction, stress and mechanical deformation appear as vibration when an electric field is applied to the ferroelectric material
Data Source
AI summary
Disclosed herein is a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, the multi-layered ceramic capacitor including dielectric sheets laminated thereon and external terminal electrodes formed at both ends thereof, the dielectric sheets having internal electrodes formed thereon, and the external terminal electrodes being connected in parallel with the internal electrode, wherein the internal electrodes are disposed to be in parallel with the circuit board, the external terminal electrodes are bonded to lands of the circuit board by a conductive material, and a bonding height (Ts) of the conductive material is lower than a sum of a gap (Ta) between the circuit board and a bottom surface of the multi-layered ceramic capacitor and a thickness (Tc) of a cover layer on a lower portion of the multi-layered ceramic capacitor, whereby vibration noise can be greatly reduced.