MLCC Mounting Structure Vibration Noise Reduction
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Solution Overview
Problem
Multi-layered ceramic capacitors generate significant vibration noise due to piezoelectricity and electrostriction, which is transferred to circuit boards, causing audible noise and discomfort, and existing solutions are insufficient in reducing this noise effectively.
Innovation Solution
A mounting structure for circuit boards with multi-layered ceramic capacitors where the inner electrodes are aligned horizontally and connected to external electrode terminals using a conductive material with a bonding area ratio less than 1.4, minimizing vibration transfer by controlling the bonding area of the conductive material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding area of the conductive material is increased to improve electrical connection, then the electrical reliability is improved, but the vibration noise increases due to stronger mechanical coupling
Solution Approach 1:
The patent applies parameter changes by precisely controlling the bonding area ratio of the conductive material to be between 0.6 and 1.4 (optimally 0.8-1.2) relative to the external electrode terminal area. This quantitative parameter optimization resolves the contradiction by finding the optimal balance point where electrical connection reliability is sufficient while vibration noise transfer is minimized, achieving both improved reliability and reduced harmful vibrations simultaneously.
2Object-generated harmful factors
If separate parts or board holes are introduced to suppress vibration propagation, then the vibration noise reduction is improved, but the device complexity and manufacturing process complexity increase
Solution Approach 1:
The patent extracts the vibration noise suppression function from separate structural components (such as vibration isolation parts or board holes) and integrates it directly into the mounting structure through the conductive material bonding area control. This eliminates the need for additional separate parts while achieving effective vibration noise reduction, thereby reducing device complexity and manufacturing process complexity while maintaining the harmful factor suppression effect.
Solution Approach 2:
The conductive material serves multiple functions simultaneously: it provides electrical connection between the capacitor and circuit board, mechanical support for the mounted component, and vibration noise suppression through optimized bonding area. This multi-functionality eliminates the need for separate vibration isolation components, reducing device complexity while achieving effective noise reduction.
3Object-generated harmful factors
If the bonding area ratio is set below 1.4, then the vibration noise is reduced, but the electrical connection strength may be compromised
Solution Approach 1:
The patent applies parameter changes by establishing a specific bonding area ratio range (0.6-1.4, optimally 0.8-1.2) that simultaneously satisfies both vibration noise reduction and bonding strength requirements. Experimental data shows that within this range, the bonding strength remains sufficient for reliable electrical connection while vibration noise is effectively suppressed, resolving the contradiction between these two opposing requirements through precise parameter optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces vibration noise to levels below 30 dB, with optimal results achieved when the bonding area ratio is between 0.6 and 1.1, enhancing noise reduction and maintaining reliability.
Implementation Method 1
connecting the land with external electrode terminals of the multi-layered ceramic capacitor by a conductive material
Implementation Method 2
Since the ferroelectric material has piezoelectricity and electrostriction, when electric field is applied to the ferroelectric material, stress and mechanical deformation are shown as vibrations
Implementation Method 3
Since the ferroelectric material has piezoelectricity and electrostriction, when electric field is applied to the ferroelectric material, stress and mechanical deformation are shown as vibrations
Data Source
AI summary
Disclosed herein is a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon. The mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, in which a dielectric layer on which inner electrodes are disposed is stacked and external electrode terminals connecting the inner electrodes in parallel are disposed on both ends thereof, wherein the inner electrodes of the multi-layered ceramic capacitor and the circuit board are disposed so as to be a horizontal direction to connect the external electrode terminals with a land on the circuit board by a conductive material and a ratio of a bonding area ASOLEDER of the conductive material to the area AMLCC of the external electrode terminals AMLCC is set to be less than 1.4, thereby remarkably reducing the vibration noise.