MLCC Electrode Insulating Substrates for Acoustic Noise Damping
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Solution Overview
Problem
Multilayer ceramic capacitors (MLCCs) generate unpleasant acoustic noise due to piezoelectric vibrations, which are exacerbated by thinner dielectric layers and fluctuating voltages, necessitating a solution to reduce noise without compromising miniaturization and capacitance.
Innovation Solution
A composite electronic component with insulating substrates containing spherical particles made of resin, which absorb vibrations caused by the piezoelectric phenomenon, reducing acoustic noise while maintaining compact size and high capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the dielectric layer is thinned and multilayered to achieve miniaturization and high capacitance, then compactness and capacitance are improved, but acoustic noise increases due to piezoelectric vibrations
Solution Approach 1:
A vibration absorption member is introduced as an intermediary component between the MLCC and the printed circuit board. This mediator absorbs the piezoelectric vibrations generated by the MLCC, preventing them from being transmitted to the board and generating acoustic noise. The vibration absorption member consists of a base layer and a vibration absorbing layer with specific structural features that enable effective vibration dampening while allowing the MLCC to maintain its thinned, multilayered structure for miniaturization and high capacitance.
Solution Approach 2:
The vibration absorption member employs composite material structure combining a base layer and a vibration absorbing layer with different material properties. The vibration absorbing layer contains through-holes filled with vibration absorption material, creating a composite structure that optimizes both mechanical support and vibration damping functions. This composite approach enables effective noise reduction without compromising the compact size and high capacitance requirements of the MLCC.
2Quantity of substance
If high voltage and voltage fluctuations are used to achieve high capacitance, then capacitance performance is improved, but acoustic noise increases due to intensified piezoelectric phenomenon
Solution Approach 1:
The vibration absorption member serves as a mediator that decouples the relationship between voltage-driven piezoelectric effects and acoustic noise transmission. By absorbing vibrations at their source before they can be transmitted through external electrodes to the printed circuit board, the system can operate at high voltages and with voltage fluctuations necessary for high capacitance performance without generating unpleasant acoustic noise in the audible frequency range.
3Ease of operation
If external electrodes extend onto the first surface to facilitate mounting, then ease of mounting is improved, but vibration transmission to the printed circuit board increases
Solution Approach 1:
The vibration absorption member is positioned between the MLCC's external electrodes and the printed circuit board, acting as an intermediary that blocks vibration transmission while allowing the external electrodes to maintain their extended configuration on the first surface for easy mounting. The base layer of the vibration absorption member provides a mounting surface that accommodates the external electrodes, while the vibration absorbing layer prevents mechanical coupling between the MLCC and the board.
Solution Approach 2:
The vibration absorbing layer functions as a flexible, vibration-damping film or structure that can accommodate the extended external electrodes while preventing rigid mechanical coupling. This flexible barrier allows the electrodes to extend onto the first surface for mounting purposes while the vibration absorbing layer absorbs mechanical vibrations, preventing their transmission to the printed circuit board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces acoustic noise by absorbing vibrations, ensuring quiet operation even at low voltages and supporting miniaturized, high-capacitance electronic devices.
Implementation Method 1
insulating substrates disposed on external electrodes, wherein the insulating substrates each include a plurality of spherical particles including a resin
Implementation Method 2
Since the dielectric layer has piezoelectricity and electrostriction, when a direct current or an alternating current voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon may occur in the dielectric layer to cause vibration
Implementation Method 3
Since the dielectric layer has piezoelectricity and electrostriction, when a direct current or an alternating current voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon may occur in the dielectric layer to cause vibration
Data Source
AI summary
A composite electronic component includes a body including a dielectric layer and first and second internal electrodes and including first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, a first external electrode disposed on the third surface and extending onto at least a portion of the first surface, a second external electrode disposed on the fourth surface and extending onto at least a portion of the first surface, a first insulating substrate disposed on a portion of the first external electrode disposed on the first surface, and a second insulating substrate disposed on a portion of the second external electrode disposed on the first surface, wherein the first and second insulating substrates each include a plurality of spherical particles inside a resin.