MLCC Overlap Geometry to Prevent Crack-Induced Short Circuits

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Solution Overview

Problem

Multilayer ceramic capacitors (MLCCs) face issues with flexural strength, leading to crack propagation from external electrode ends to overlapping regions, causing short circuits, while reducing the number of laminated internal electrodes or the size of overlapping regions compromises capacitance and DC-bias properties.

Innovation Solution

A multilayer electronic component design with a central portion of the overlapping region having a longer length in the second direction than the ends, incorporating dummy electrodes to prevent crack propagation and maintain electrical properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the number of laminated internal electrodes or the size of the overlapping region is reduced to prevent crack propagation, then reliability is improved, but capacitance and DC-bias properties deteriorate

Engineering Contradiction:
Improveshort circuit preventionVSAvoidcapacitance
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The overlapping region is designed with non-uniform width, where the central portion has a greater width than the end portions. This local variation in geometry creates a stress distribution pattern that directs cracks away from the overlapping region while preserving the overall capacitance through maintained electrode area

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent introduces a width dimension variation within the overlapping region (different widths at center vs. ends) to control crack propagation paths. This dimensional modification allows the overlapping region to maintain its area for capacitance while creating a geometric barrier to crack propagation

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If flexural strength is improved to prevent crack occurrence, then reliability is improved, but device complexity increases due to structural modifications

Engineering Contradiction:
Improvecrack resistanceVSAvoidoverlapping region structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The overlapping region employs an asymmetric width profile where the central portion is wider than the end portions. This asymmetric geometry inherently redirects stress and crack paths away from the overlapping region, improving flexural strength and crack resistance without requiring additional components or complex manufacturing processes

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS20250218668A1Multilayer electronic component
Publication Date: 2025.07.03 SAMSUNG ELECTRO MECHANICS CO LTD
  • US20250218668A1 patent drawing
  • US20250218668A1 patent drawing
  • US20250218668A1 patent drawing

AI summary

A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween, a first external electrodes connected to the first electrode, and a second external electrode connected to the second electrode. The body includes an overlapping region in which the first internal electrode overlaps the second internal electrode adjacent thereto in the first direction with the dielectric layer interposed therebetween. A length in a second direction of a central portion of the overlapping region in the first direction is greater than that of both ends of the overlapping region in the first direction. The body has a crack extending to the inside of the body from an end of at least one of the first and second external electrodes, the crack spaced apart from the overlapping region.