MLCC External Electrode Pd Plating for High-Temperature Mounting
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Solution Overview
Problem
Multilayer ceramic capacitors (MLCCs) used in high-temperature environments, such as automobile engine bays, face mechanical stress due to temperature-induced expansion and contraction of solder, leading to reliability issues and increased manufacturing costs when using traditional solder bonding methods.
Innovation Solution
A multilayer electronic component with a Pd plating layer on the external electrodes, specifically on the lower band portions and connection portions, is mounted using a conductive resin adhesive, reducing thermal stress and corrosion while optimizing the Pd plating layer's placement to minimize manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder bonding is used to mount MLCC on substrate, then electrical connectivity is achieved, but mechanical stress from thermal expansion causes solder cracks and reduces reliability
Solution Approach 1:
The patent changes the material parameter of the bonding agent from traditional solder to conductive resin adhesive. This material substitution fundamentally alters the thermal and mechanical properties of the bonding interface, enabling it to withstand high-temperature environments without cracking while maintaining electrical conductivity.
Solution Approach 2:
The patent employs a composite plating structure consisting of multiple layers (base metal layer, intermediate layer, and Pd plating layer) on the external electrodes. This composite material approach optimizes both mechanical strength and corrosion resistance, allowing the electrode assembly to better withstand thermal stress and environmental exposure.
2Reliability
If Pd plating layer is applied on entire external electrode surface, then corrosion resistance is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies Pd plating selectively only to specific regions of the external electrode (connection portion and portions of band portions that will contact conductive resin adhesive) rather than the entire surface. This localized plating approach maintains corrosion resistance where needed while significantly reducing Pd material consumption and manufacturing cost.
Solution Approach 2:
The patent uses partial plating coverage instead of complete surface plating. By applying Pd plating only to the extent necessary for achieving corrosion resistance and electrical connectivity, the patent avoids excessive material usage while still meeting performance requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability and reduces manufacturing costs of MLCCs by preventing corrosion and mechanical stress, maintaining electrical connectivity, and ensuring effective bonding with conductive resin adhesives, even in high-temperature conditions.
Implementation Method 1
The external electrode includes a Pd plating layer disposed on an external surface of the lower band portion
Implementation Method 2
a conductive resin adhesive bonding the external electrode to the electrode pad
Data Source
AI summary
A multilayer electronic component includes: a body including a dielectric layer and internal electrodes and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode including a connection portion disposed on one of the third and fourth surfaces, an upper band portion extending from the connection portion onto a portion of the second surface, and a lower band portion extending onto a portion of the first surface. The external electrode includes a Pd plating layer disposed on an external surface of the lower band portion, and the Pd plating layer is disposed to extend onto a portion of the connection portion.