MLCC Permeation Layer Structure for Moisture Resistance
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Solution Overview
Problem
Multilayer electronic components, such as MLCCs, are prone to moisture penetration and external impacts, leading to reduced moisture resistance reliability and rigidity due to surface irregularities and pores, which can cause cracks and deteriorate performance.
Innovation Solution
A permeation layer is introduced inside the multilayer electronic component, with a higher content of subcomponent elements than the dielectric layer, to seal surface pores and improve surface roughness, enhancing moisture resistance and rigidity by applying a liquid additive that permeates into the surface after sintering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional sintering process is used to manufacture multilayer electronic components, then manufacturing efficiency is maintained, but surface pores and irregularities form that reduce moisture resistance reliability
Solution Approach 1:
A permeation layer is formed on the surface of the multilayer electronic component before final sintering. This layer contains subcomponent elements that will permeate into the body during sintering to fill and seal surface pores and irregularities, preventing moisture penetration pathways before they can cause damage
Solution Approach 2:
The composition of the permeation layer is specifically designed with subcomponent elements at controlled concentrations. During sintering, these elements diffuse into the body at controlled rates and depths, transforming the surface structure by filling pores and smoothing irregularities without compromising the underlying dielectric layer properties
2Reliability
If the body structure is densified to reduce pores, then moisture resistance improves, but manufacturing complexity increases
Solution Approach 1:
The permeation layer is applied specifically to the surface region where moisture penetration occurs, rather than requiring uniform densification throughout the entire component. This localized approach addresses the moisture resistance issue at the critical surface interface while maintaining the bulk structure and simplifying the overall manufacturing process
Solution Approach 2:
The multilayer electronic component is constructed as a composite structure with a dielectric layer body and a permeation layer containing subcomponent elements. This composite approach combines the electrical functionality of the dielectric layer with the moisture protection functionality of the permeation layer, achieving enhanced moisture resistance through material composition rather than complex structural modifications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The permeation layer effectively seals surface pores and irregularities, improving moisture resistance and rigidity while maintaining electrical properties, thus enhancing the component's reliability and lifespan.
Implementation Method 1
A permeation layer is introduced inside the multilayer electronic component, with a higher content of subcomponent elements than the dielectric layer, to seal surface pores and improve surface roughness
Data Source
AI summary
A multilayer electronic includes a body including a permeation layer disposed inside the body and in contact with a surface of the body, a dielectric layer, and internal electrodes and external electrodes disposed on the body, wherein an average content of subcomponent element included in the permeation layer is higher than an average content of subcomponent elements included in the dielectric layer, and an average surface roughness of the body is 0.01 nm or more and 40 nm or less.