Multilayer Ceramic Capacitor External Electrode Plating
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Solution Overview
Problem
The existing methods for forming external electrodes on multilayer electronic devices, such as ceramic capacitors, face challenges in achieving reliable connections between internal electrodes due to the thickness of paste electrode films and the difficulty in forming plating deposits across large distances, which can lead to connection failures and increased manufacturing costs.
Innovation Solution
A method involving the adherence of conductive particles with a diameter of 1 μm or more to the laminate surface, followed by direct plating, which promotes cross-linking of plating deposits and allows for the formation of external electrodes on both end and side surfaces without the need for dummy electrodes, thereby enhancing solder wettability and reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If paste electrode films of large thickness are used to ensure reliable electrical connection, then connection reliability is improved, but the effective volume for electrostatic capacity is decreased
Solution Approach 1:
The invention extracts and eliminates the paste electrode film layer from the external electrode structure. Instead of using traditional thick paste electrode films (several tens to hundreds of micrometers), the patent applies plating films directly to the internal electrodes, removing the unnecessary intermediate layer and reducing overall electrode thickness while maintaining connection reliability.
Solution Approach 2:
The invention changes the physical and chemical parameters of the electrode formation process by transitioning from paste application and firing to direct plating. This parameter change enables the formation of thin, uniform plating films (several micrometers thick) that provide reliable electrical connection without sacrificing effective volume for electrostatic capacity.
2Reliability
If plating deposits are grown to cross-link across large distances between internal electrodes, then connection reliability is improved, but the manufacturing complexity increases
Solution Approach 1:
The invention applies preliminary action by first forming a thin plating film on the internal electrodes before applying the external electrode paste. This preliminary plating layer serves as a foundation that facilitates subsequent paste firing and ensures reliable electrical connection between internal electrodes and external electrodes, simplifying the overall manufacturing process.
Solution Approach 2:
The invention introduces a plating film as an intermediary layer between the internal electrodes and the external electrode paste. This intermediary plating layer facilitates the electrical connection and simplifies the manufacturing process by enabling direct plating without requiring complex dummy electrode structures or extensive plating growth across large distances.
3Ease of manufacture
If dummy electrodes are added to enable plating cross-linking on side surfaces, then external electrode formation is improved, but the manufacturing cost and process complexity increase
Solution Approach 1:
The invention extracts and eliminates the need for dummy electrodes from the manufacturing process. By applying plating films directly to the internal electrodes and using this plating layer as the foundation for external electrodes, the patent removes the unnecessary dummy electrode step, simplifying the manufacturing process and reducing costs.
Solution Approach 2:
The invention makes the plating film multi-functional by using it both as the electrical connection layer between internal electrodes and as the base for external electrodes. This universal application of the plating film eliminates the need for separate dummy electrodes, reducing manufacturing complexity while enabling external electrode formation on both end and side surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures reliable formation of external electrodes across larger distances, improves solder wettability, and reduces manufacturing costs by eliminating the need for dummy electrodes, while maintaining high bonding strength and electrostatic capacity.
Implementation Method 1
the adherence of conductive particles with a diameter of 1 μm or more to the laminate surface
Implementation Method 2
followed by direct plating, which promotes cross-linking of plating deposits
Data Source
AI summary
A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 μm or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.