MLCC External Electrode Plating for Hydrogen Barrier Reliability
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Solution Overview
Problem
Hydrogen permeation during the formation of a plating layer on the external electrode of a multilayer ceramic capacitor can lead to reduced reliability due to diffusion into the internal electrode and dielectric, compromising the capacitor's performance.
Innovation Solution
A multilayer electronic component design featuring a copper electrode layer with a thin first nickel plating layer and a thicker second nickel plating layer, accompanied by a nickel oxide layer at their boundary, and a vacuum heat treatment process to effectively remove hydrogen, enhancing adhesion and sealing properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plating layer is formed on the external electrode to protect it and secure electrical connectivity, then the protection and electrical connectivity are improved, but hydrogen permeates into the external electrode and diffuses into the internal electrode and dielectric, causing lower reliability
Solution Approach 1:
The external electrode is segmented into multiple functional layers: a copper electrode layer for electrical connectivity, a first nickel plating layer (0.1-0.9 μm thick) as a hydrogen barrier, and a second nickel plating layer (1.0-3.0 μm thick) for protection and solderability. This segmentation allows each layer to perform its specific function while collectively preventing hydrogen permeation into the internal electrode and dielectric.
2Object-affected harmful factors
If a thick nickel plating layer is used to prevent hydrogen permeation, then hydrogen barrier properties are improved, but the adhesion between plating layers and the vacuum heat treatment time required increases
Solution Approach 1:
The thickness of the first nickel plating layer is precisely controlled within 0.1-0.9 μm to optimize the balance between hydrogen barrier properties and vacuum heat treatment time. This parameter optimization ensures sufficient hydrogen blocking capability while maintaining reasonable processing time and adhesion quality.
3Loss of time
If the first nickel plating layer is made thin to reduce vacuum heat treatment time, then processing time is reduced, but the hydrogen barrier capability may be compromised
Solution Approach 1:
The external electrode uses a composite plating structure with two nickel layers of different thicknesses and functions. The first nickel layer (0.1-0.9 μm) provides hydrogen barrier properties, while the second nickel layer (1.0-3.0 μm) provides mechanical protection and solderability. This composite structure achieves both hydrogen protection and reasonable processing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents hydrogen permeation, improving the reliability and moisture resistance of the multilayer ceramic capacitor by ensuring effective removal of hydrogen, thereby maintaining capacitor performance under high temperature and environmental stress.
Implementation Method 1
An oxide including nickel (Ni) is positioned on a boundary surface between the first plating layer and the second plating layer
Implementation Method 2
a vacuum heat treatment process to effectively remove hydrogen
Data Source
AI summary
A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately positioned while having the dielectric layer interposed therebetween; and an external electrode positioned on the body. The external electrode includes an electrode layer connected to one or more of the internal electrodes and including copper (Cu), a first plating layer positioned on the electrode layer and including nickel (Ni), and a second plating layer positioned on the first plating layer and including nickel (Ni). An oxide including nickel (Ni) is positioned on a boundary surface between the first plating layer and the second plating layer. An average thickness of the first plating layer is smaller than an average thickness of the second plating layer.