MLCC Plating Extension Structure for Moisture Resistance
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with insulation resistance deterioration in humid environments due to moisture and hydrogen penetration through openings at the interface between the body and plating layer at the end of the external electrode, compromising moisture resistance reliability.
Innovation Solution
The multilayer electronic component design includes a plating layer with extensions that contact the body, featuring grains with angles between the body surface and major axis between 70 degrees and 110 degrees, enhancing the bonding force and improving moisture resistance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the plating layer is disposed on the external electrode, then electrical conductivity and corrosion resistance are improved, but the interface between the body and plating layer opens at the end of the band portion forming a penetration path for moisture and hydrogen
Solution Approach 1:
The patent applies local quality by creating a protrusion structure at specific locations (end of the band portion) of the plating layer. This protrusion locally extends the plating layer onto the body surface, providing enhanced moisture barrier protection precisely where the interface opening occurs, while maintaining the standard plating layer structure in other regions.
Solution Approach 2:
The patent transitions from a two-dimensional plating layer configuration to a three-dimensional structure by forming a protrusion that extends vertically onto the body surface. This dimensional change creates an overlapping region that blocks the moisture penetration path formed by the interface opening at the band portion end.
2Strength
If the plating layer extends onto the body to contact the body, then bonding force is improved, but grain structure control becomes more complex
Solution Approach 1:
The patent applies parameter changes by controlling the grain structure parameters of the plating layer, specifically the angle between the major axis of the grain and the surface of the body. By specifying that this angle is 70 degrees or more and 110 degrees or less, the patent optimizes the grain orientation to enhance bonding force between the plating layer and the body.
Data Source
AI summary
A multilayer electronic component may include: a body including a dielectric layer and internal electrodes; and external electrodes including an electrode layer disposed on the body and a plating layer disposed on the electrode layer, wherein the plating layer includes an extension extending onto the body to contact the body, and the extension includes one or more grains in which an angle between a surface of the body in contact with the extension and a major axis of the grain is 70 degrees or greater and 110 degrees or less.