Multilayer Ceramic Capacitor Plating Thickness for Moisture Resistance
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with moisture resistance reliability due to plating discontinuation and glass beading phenomena, which compromise their performance in diverse environments.
Innovation Solution
A multilayer ceramic capacitor design that includes a first plating portion with a thickness of 0.3 μm to 1 μm between the electrode layers and a second plating portion, preventing plating discontinuation and enhancing moisture resistance reliability, even at thinner dielectric and cover portion thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a general plating method is used to form Ni-plated and Sn-plated layers on the electrode layer, then the external electrode can be formed, but plating discontinuation occurs due to electrode layer discontinuation and glass beading phenomenon
Solution Approach 1:
The patent changes the thickness parameter of the first plating portion to a specific range (0.3 μm to 1 μm) to prevent plating discontinuation. This parameter optimization ensures that the plating layer is thick enough to bridge discontinuities in the electrode layer and cover glass beading, while not being excessively thick to cause other issues. This resolves the contradiction by finding the optimal thickness parameter that maintains both plating continuity and moisture resistance reliability.
Solution Approach 2:
The patent introduces a first plating portion as an intermediary layer between the electrode layer and the second plating portion. This intermediate layer serves as a buffer that compensates for discontinuities in the electrode layer and prevents glass beading from affecting the second plating portion, thereby ensuring continuous plating and improved moisture resistance reliability.
2Volume of moving object
If the dielectric layer and cover portion thickness are reduced to achieve thinner capacitor design, then the capacitor size is reduced, but moisture resistance reliability deteriorates
Solution Approach 1:
The patent optimizes the thickness parameter of the first plating portion (0.3 μm to 1 μm) to compensate for the reduced thickness of the dielectric layer and cover portion. This parameter change in the plating layer provides an additional protective barrier that maintains moisture resistance reliability even when the overall capacitor thickness is reduced, thereby resolving the contradiction between miniaturization and reliability.
Solution Approach 2:
The patent segments the plating structure into two distinct portions: a first plating portion directly on the electrode layer and a second plating portion on the first plating portion. This segmentation allows the first plating portion to specifically address the issue of electrode layer discontinuation and glass beading, while the second plating portion provides the outer protective layer, thereby maintaining moisture resistance reliability in thinner capacitor designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively secures sufficient moisture resistance reliability, preventing plating discontinuation and maintaining performance in thin configurations, thus ensuring the capacitors' reliability across various environmental conditions.
Implementation Method 1
a first plating portion disposed on the electrode layer and having a thickness ranging from 0.3 μm to 1 μm
Data Source
AI summary
A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a first plating portion disposed on the electrode layer and having a thickness ranging from 0.3 μm to 1 μm, and a second plating portion disposed on the first plating portion.